Technical specifications for 1771-A3B
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Dimensions
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483 x 339 x 221 mm or 19.0 x 13.35 x 8.7 inches
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Vibration
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2 g (at 10-500 Hertz)
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Operating Shock
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15 g
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Enclosure Type
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Open Style
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Mount Type
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Panel mount; Rack mount
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Max Backplane Current (at 5 Volts DC)
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24 Amperes
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Number of Module I/O Slots
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12 Slots
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Module Type
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I/O Chassis
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Part Number/Catalog No.
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1771-A3B
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Weight
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5.9 kg or 13 lbs
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Operating Temperature
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0 - 60 °C (32 - 140 °F)
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Relative Humidity
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5-95% non-condensing
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Nonoperating Shock
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30 g
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Location
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Stand-Alone
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The 1771-A3B is an I/O chassis designed for use with 1771 I/O modules. It is a key component in modular systems, enabling the installation of various I/O modules and facilitating communication between the modules and processor or I/O adapter through the backplane. The chassis features 12 I/O slots and measures 13.53 x 19.0 x 8.5 inches, with a weight of 19.1 lbs. It can be mounted using a 19-inch rack or back-panel installation method, requiring adequate spacing and an open enclosure. The backplane of the chassis provides power supply of 8A at 5V DC.
This chassis is universally designed for mounting and system integration, making it highly adaptable for a variety of applications. The I/O modules are compact, flexible, and cost-effective, offering a complete range of digital, analog, and intelligent I/O solutions. Each module comes with wiring arms and remote termination panels, making module replacement straightforward without the need for disconnecting wiring. For troubleshooting, status indicators are included on the front of the modules.
The 1771-A3B chassis supports future expansion by being easily replaceable with larger chassis configurations. It is engineered for industrial environments, with an operating temperature range of 0 - 60 °C (32 - 140 °F), 5-95% non-condensing relative humidity, and a 30g operating shock tolerance.
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