5G Base Station PCB
As the 5G frequency band increases and the frequency increases, the number of RF front-end components increases significantly. On the other hand, as the 5G transmission data increases significantly, the data processing capabilities of the base station BBU have higher requirements, and the BBU will use a larger area. For higher-layer PCBs, high-speed and high-frequency materials are required for the substrate. The selection of plates must meet the requirements of high frequency and high speed, impedance matching, stacking planning, wiring spacing/holes, etc. must meet the signal integrity requirements, which can be from loss, embedding, high frequency phase/amplitude, mixed voltage, the characteristics of heat dissipation and PIM. 5G communications PCB features, high density, integration, high frequency, multilayer, miniaturization and high speed.
FAQ:
Q: What files required to get 5G PCB quotation from you?
A: For 5G PCB quotation, please provide Gerber data/ files and BOM list (bill of materials), and if you need us to do function test, please also provide the test instruction/procedure.
Q: How do you control the 5G PCB quality?
A: For 5G PCB sample, usually tested by flying probe.For PCB Volume over 3 square meters, usually tested by fixture, this will be more faster. Due to there’s many steps to PCB production, we usually do inspection after every step.
Q: Are my design files safe when I submit them to you for 5G PCB manufacturing and assembly?
A: Any customer’s files will be protected well and we will not let any third party know. We can sign NDA with you.
