DBC Ceramic Substrates for Semiconductor

The Direct Bond Copper is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.