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Metalized Direct Bonding Copper(DBC) Al2O3/ZTA Ceramic sheet
Direct Bond Copper (DBC) ceramic substrate is a new type of composite material in which highly insulating Alumina (Al2O3) or Aluminum Nitride (AlN) ceramic substrates are laminated with copper metal. Product Details: Material: Alumina/ZTA/Si3N4. Function: Insulating and heat dissipation ceramic. Type: Metalized ceramic. Can be customed: Yes, please provide drawings of specific products.
Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules
The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT
DBC ceramic substrate has high thermal conductivity, high current capacity and heat dissipation of the high-purity on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.
