Active Metal Brazing(AMB) Ceramic Substrate Used for IGBT Modules
Product Description:
Active Metal Brazing(AMB) process is a further development of the Direct Bonded Copper(DBC) process technology. It is a method of joining ceramics to metals by using a small amount of active elements contained in the brazing material to react with ceramics to create a reaction layer that can be wetted by the liquid brazing material.
At present, with the rapid development of power electronics technology, high-power device control modules on high-speed rail on the IGBT module packaging of key materials-ceramic copper-clad panels form a huge demand, especially the AMB substrate gradually become mainstream applications.
Our Aluminum Nitride(AlN) substrates are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project.
Our Service:
Please contact us for customization.
Specification:
| Copper/Ceramic/Copper specification（mm） |
| AlN-AMB |
0.30/0.38/0.30 |
0.30/0.64/0.30 |
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| Si3N4-AMB |
0.25/0.32/0.25 |
0.30/0.32/0.30 |
0.80/0.32/0.80 |
1.20/0.32/1.20 |
| ZTA-AMB |
0.30/0.32/0.30 |
0.40/0.32/0.40 |
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Company Advatage:
Huaqing founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop & Equipment:
Package & Delivery:
Deliver by UPS, DHL, Fedex etc.
