MX-718 Advancedleveling acid copper
additive
Features:
1. Fast bright dipping, clear plating. Great plating can be
achieved over a low current density range, especially with high content of iron
impurities.
2. Widely-applied concentration,
especially suitable for plating complex iron-based work pieces.
3. Additive components are hard to decompose, the solution is easy to control and
lengthen the time interval of processing cycle.
4. At high temperature, little effect on the brightness of
low area.
5. High impurities toleration, when it reaches about 800-1000 ampere hour/L, it will need carbon powder to process.
Plating
solution composition and operation condition:
|
material and operation condition
|
Scope
|
standard(open cylinder volume)
|
|
CuSO4·5H2O
|
180-230g/L
|
210g/L
|
|
H2SO4(98%)
|
Weight
|
50-70g/L
|
60g/L
|
|
volume
|
27-38ml/L
|
33ml/L
|
|
Cl-
|
40-110mg/L
|
80mg/L
|
|
MX-718Mu
|
4-6ml/L
|
5ml/L
|
|
MX-718A
|
0.3-0.7ml/L
|
0.5 ml/L(Remark①)
|
|
MX-718B
|
0.2-0.6ml/L
|
0.4 ml/L
|
|
Temperature
|
15-40℃
|
24-28℃
|
|
Cathodic current
density
|
1-8A/ dm2
|
3-5A/dm2
|
|
Anode
|
phosphorous copper
anode(phosphorus content 0.03-0.06%)
|
|
Mixing method
|
Air mixing
|
Additive consumption as follows:
|
acid
copper additive
|
Consumption
|
|
MX-718Mu
|
60-80ml/KAH
|
|
MX-718A
|
60-80ml/KAH
|
|
MX-718B
|
50-70ml/KAH
|
