MX-818Advancedleveling acid copper
additive
Features:
1. Leveling plating, strong dispensability, suitable for highly-demanded
leveling products, such as, plastic cement, bathroom fittings, and auto
accessories.
2. Additive components are hard to decompose, the solution is easy to control and
lengthen the time interval of processing cycle.
3. Over a broad current density range, bright, leveling
copper plating will be acquired.
4. At high temperature, little effect on the brightness of
low area ;
5. High impurities toleration, when it reaches about 800-1000 ampere hour/L, it will need carbon powder to process.
Plating
solution composition and operation condition:
|
material and operation condition
|
scope
|
standard(open cylinder volume)
|
|
CuSO4·5H2O
|
180-230g/L
|
210g/L
|
|
H2SO4(98%)
|
weight
|
50-70g/L
|
60g/L
|
|
volume
|
27-38ml/L
|
33ml/L
|
|
Cl-
|
40-110mg/L
|
80mg/L
|
|
MX-818Mu
|
4-6ml/L
|
5ml/L
|
|
MX-818A
|
0.4-0.8ml/L
|
0.6 ml/L(Remark①)
|
|
MX-818B
|
0.2-0.6ml/L
|
0.4 ml/L
|
|
temperature
|
15-40℃
|
24-28℃
|
|
Cathodic current
density
|
1-8A/ dm2
|
3-5A/dm2
|
|
Anode
|
phosphorous copper
anode(phosphorus content 0.03-0.06%)
|
|
Mixing method
|
Air mixing
|
Additive consumption as follows:
|
acid
copper additive
|
Consumption
|
|
MX-818Mu
|
60-80ml/KAH
|
|
MX-818A
|
60-80ml/KAH
|
|
MX-818B
|
50-70ml/KAH
|
