Aluminum Nitride Ceramic Electrostatic Chuck for Semiconductor
Product Description:
In modern semiconductor manufacturing process, wafers are processed in multiple steps, and the wafers need to be transferred back and forth between hundreds of process equipment. So a device is needed for wafer clamping. Electrostatic chuck can hold wafers by electrostatic absorption, the absorption force is uniform and stable, and the wafers will not be warped and deformed, which can ensure the processing accuracy and cleanliness of wafers.
Our Service:
Our Aluminum Nitride Substrate are available in various sizes and thicknesses.
Specification:
| Dimension(LxW) |
φ110*110mm |
| Thickness |
5mm etc. |
| Thermal Conductivity |
170W/m.K |
| Dielectric Constant |
8-9 (MHz) |
| Bulk Density |
3.3 g/cm³ |
| Surface Roughness |
Ra < 0.6 μm on both sides |
Company Advantage:
Huaqing founded in 2004, with sum investment of 80 million RMB, registered capital 40 million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop&Equipment:
Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc.
