Ceramic heating control board PCBA
1. Layers: Single Sided,2 to 18 Layer
2. Board material type: FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more
3. Compound material lamination: 4 to 6 layers
4. Maximum dimension: 610 x 1,100mm
5. Dimension tolerance: ±0.13mm
6. Board thickness coverage: 0.2 to 6.00mm
7. Board thickness tolerance: ±10%
8. DK thickness: 0.076 to 6.00mm
9. Minimum line width: 0.10mm
10. Minimum line space: 0.10mm
11. Outer layer copper thickness: 8.75 to 175µm
12. Inner layer copper thickness: 17.5 to 175µm
13. Drilling hole diameter (mechanical drill): 0.25 to 6.00mm
14. Finished hole diameter (mechanical drill): 0.20 to 6.00mm
15. Hole diameter tolerance (mechanical drill): 0.05mm
16. Hole position tolerance (mechanical drill): 0.075mm
17. Laser drill hole size: 0.10mm
18. Board thickness and hole diameter ratio: 10:1
19. Solder mask type: Green, Yellow, Black, Purple, Blue, White and Red
20. Minimum solder mask: Ø0.10mm
21. Minimum size of solder mask separation ring: 0.05mm
22. Solder mask oil plug hole diameter: 0.25 to 0.60mm
23. Impedance control tolerance: ±10%
24.Surface finish: Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger
Ceramic heating control board PCBA
According to the temperature change of the working environment, the physical deformation occurs in the switch, which produces some special effects, and produces a series of automatic control elements for the on-off or on-off action
Ceramic heating control board PCBA production process:
1. Driil
2. PTH line
3. Image transfer
4. Cu Tin plated
5. Etching
6. Soldermask
7. Silkscreen
8. Surface finish
9. Routing
10. Testing
11. Packing
Ceramic heating control board electronic pcb assembly
Adjustable temperature, fast response control.
Ceramic heating control board PCBA product advantage
High heating capacity, high efficiency.