DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT
Product Description:
Direct Bonding Copper is a kind of composite line subgrade board that is directly sintered copper foil to ceramic surface by hot-melt bonding method at high temperature, which can withstand high voltage and large current.
DBC ceramic substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of IGBT modules.
Our Service:
Please contact us for customization.
Specification:
| Copper/Ceramic/Copper specification（mm） |
| Al2O3-DBC |
0.20/0.38/0.20 |
0.25/0.38/0.25 |
0.3/0.38/0.30 |
0.20/0.64/0.20 |
0.25/0.64/0.25 |
0.30/0.64/0.30 |
| ZTA-DBC |
0.20/0.32/0.20 |
0.25/0.32/0.25 |
0.30/0.32/0.30 |
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Company Advantage:
Huaqing founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop&Equipment:
Packaging & Delivery:
Deliver by UPS, DHL, Fedex etc.
