Dissipating Materials Nano AlN Powders Used in Electronics
Spec: 100-200nm, 300-500nm, 1-2um, 99.5%, amouphous
Application for nano AlN powder:
Electronic materials:
thermal conductivity of aluminum nitride is about 10 times the aluminum oxide,
can be effectively dissipate heat, manufacturing integrated circuits substrate,
electronic devices, optical devices, radiators, temperature crucible prepared metal
polymer matrix composites, especially in high temperature sealing adhesives and
electronic seals loading materials to improve the cooling performance and
strength characteristics there is an excellent prospect.
Such as the application
in thermal silica and conductive epoxy: Use nano aluminum nitride to prepared
ultrahigh thermal silica, which has good thermal conductivity, good insulation
properties over point, wide electrical insulation and temperature (temperature
80-250 ° C), low consistency and good construction performance, it is widely
used in the heat transfer medium of electronic devices, improve work
efficiency. Real practical application in many fields, such as nano-thermal
paste application as CPU and heat sink, power transistors, thyristors, diodes,
contact with the substrate slit at a heat transfer medium, increase the contact
area between them, to achieve better cooling effect.
