Double
Sided Aluminum PCB Dual Layer Aluminum Circuit Board 2-Layer MCPCB
(Aluminum
PCB’s are custom-made products, the picture and parameters shown are just for
reference)
1.1
General Description:
This overall thickness is 2.0mm typical from copper to aluminum base,
>2000V AC isolation, 1 W/MK thermal conductivity, 2oz copper each layer. The
CCL plate is from Totking, ink of solder mask and silkscreen from Taiyo. It's
fabricated per IPC 6012 Class 2 using supplied Gerber data. 25 boards are
packed for shipment.
1.2
PCB Specifications:
PCB SIZE
|
500 x
150mm=10PCS
|
BOARD TYPE
|
IMS
mcpcb
|
Number
of Layers
|
Double sided
PCB, Metal core PCB
|
Surface
Mount Components
|
YES
|
Through
Hole Components
|
NO
|
LAYER STACKUP
|
copper
------- 70um(2oz)
|
dielectric material 75um
|
copper ------- 70um(2oz)
|
dielectric material 75um
|
Aluminum backed 1.8mm
|
TECHNOLOGY
|
|
Minimum Trace and Space:
|
5.98mil/6.18mil
|
Minimum
/ Maximum Holes:
|
0.3/2.2mm
|
Number
of Different Holes:
|
5
|
Number
of Drill Holes:
|
548
|
Number
of Milled Slots:
|
11
|
Number
of Internal Cutouts:
|
0
|
Impedance
Control
|
no
|
BOARD
MATERIAL
|
|
Thermal
conductivity
|
2W
/ MK
|
Final
foil external:
|
2oz
|
Final
foil internal:
|
2oz
|
Final
height of PCB:
|
2.1mm
±0.2
|
PLATING AND COATING
|
|
Surface Finish
|
Hot Air
Soldering Leveling(HASL),lead free, Sn>=2.54µm
|
Solder
Mask Apply To:
|
Top, 12micon
Minimum.
|
Solder
Mask Color:
|
Super White for
LED
|
Solder
Mask Type:
|
LPSM
|
CONTOUR/CUTTING
|
Routing
|
MARKING
|
|
Side of
Component Legend
|
TOP
|
Colour
of Component Legend
|
Black
|
Manufacturer
Name or Logo:
|
Marked on the
board in a conductor and leged FREE AREA
|
VIA
|
via tented.
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
DIMENSION TOLERANCE
|
|
Outline
dimension:
|
0.0059"
(0.15mm)
|
Board
plating:
|
0.0030"
(0.076mm)
|
Drill
tolerance:
|
0.002"
(0.05mm)
|
TEST
|
100%
Electrical Test prior shipment
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
SERVICE AREA
|
Worldwide,
Globally.
|
1.3
Applications of Aluminum PCB:
Power
Hybrid IC
Audio
Frequency Apparatus:
Input
/ Output Amplifier, Balanced Amplifier, Pre-amplifier, Audio amplifier
Power
supply device: Switch regulator, DC/AC Converter, Switch regulator
Communication
electronic equipment: High frequency generator, Filter appliance, Transmission
circuit
Office
automation equipment: Motor drive
Automotive:
Electronic regulator, Igniter, Power controller
Computer:
CPU board, Floppy disk drive, Power supply unit
Power
module: Converter, Solid relay, Rectifier bridge
Lamp
lighting: All kinds of energy-saving and gorgeous LED lights
1.4
Layer up:
The
most common MCPCB construction consists of the following 3 layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate
is more appropriate due to its high thermal conductivity than aluminum (401W/MK
versus 237 W/MK) but more expensive.
2) Epoxy dielectric layer. This is the most important layer in the MCPCB
construction as it affects the thermal performance, electrical breakdown
strength, and, in some cases, the solder joint performance of the MCPCB system.
The typical thermal conductivity of the dielectric layer on a MCPCB is 1W/MK. A
higher value is better for good thermal performance. A thinner dielectric layer
is better for thermal performance as well but can negatively impact the ability
of the MCPCB to withstand a high potential test to meet minimum electrical
safety standards as required in certain lighting markets. The typical
dielectric thickness layer is 100μm.
3)Top copper layer. A thicker copper layer
improves heat spreading into the PCB but may pose challenges for PCB
manufacturers when fabricating narrow traces or spaces. A copper thickness of
1oz (35μm) or 2oz (70μm) is common.
1.5
Manufacturing Process of MCPCB:
The process can be described as a flow diagram as follows.
1.6
Metal Core PCB Capability 2022:
NO.
|
Parameter
|
Value
|
1
|
Type
of Metal Core
|
Aluminum,
Copper, Iron
|
2
|
Model
of Metal Core
|
A1100,
A5052, A6061, A6063, C1100
|
3
|
Surface
Finish
|
HASL,
Immersion Gold, Immersion Silver, OSP
|
4
|
Thickness
of Surface plating
|
HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
|
5
|
Layer
Count
|
1-2
Layers
|
6
|
Maximum
of Board Size
|
23"
x 46" (584mm×1168mm)
|
7
|
Mininum
of Board Size
|
0.1969"
x 0.1969" (5mm×5mm)
|
8
|
Board
Thickness
|
0.0157"
x 0.2362" (0.4-6.0mm)
|
9
|
Copper
Thickness
|
0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
|
10
|
Minimum
Track Width
|
5mil
(0.127mm)
|
11
|
Minimum
Space
|
5mil
(0.127mm)
|
12
|
Minimum
Hole Size
|
0.0197"
(0.5mm)
|
13
|
Maximum
Hole Size
|
No
limit
|
14
|
Minimum
Holes Punched
|
PCB
thickness <1.0mm: 0.0394" (1.0mm)
|
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
|
15
|
PTH
Wall Thickness
|
>20µm
|
16
|
Tolerance
of PTH
|
±0.00295"
(0.075mm)
|
17
|
Tolerance
of NPTH
|
±0.00197"
(0.05mm)
|
18
|
Deviation
of Hole Position
|
±0.00394"
(0.10mm)
|
19
|
Outline
Tolerance
|
Routing:
±0.00394" (0.1mm)
|
Punching: ±0.00591" (0.15mm)
|
20
|
Angle
of V-cut
|
30°,
45°, 60°
|
21
|
V-cut
Size
|
0.1969"
x 47.24" (5mm×1200mm)
|
22
|
Thickness
of V-cut Board
|
0.0236"
x 0.1181" (0.6-3mm)
|
23
|
Tolerance
of V-cut Angle
|
±5º
|
24
|
V-CUT
Verticality
|
≤0.0059" (0.15mm)
|
25
|
Minimum
Square Slots Punched
|
PCB
thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
|
PCB thickness 1.2-3.0mm: 0.0394" x
0.0394" (1.0 x 1.0mm)
|
26
|
Minimum
BGA PAD
|
0.01378"
(0.35mm)
|
27
|
Minimum
Width of Solder Mask Bridge.
|
8mil
(0.2032mm)
|
28
|
Minimum
Thickness of Solder Mask
|
>13µm
(0.013mm)
|
29
|
Insulation
Resistance
|
1012ΩNormal
|
30
|
Peel-off
Strength
|
2.2N/mm
|
31
|
Solder
float
|
260℃3min
|
32
|
E-test
Voltage
|
50-250V
|
33
|
Thermal
Conductivity
|
0.8-8W/M.K
|
34
|
Warp
or Twist
|
≤0.5%
|
35
|
Flammability
|
FV-0
|
36
|
Minimum
Height of Component indicator
|
0.0059"(0.15mm)
|
37
|
Minimum
Open Solder Mask on Pad
|
0.000394"
(0.01mm)
|
1.7
More Displays of Double Sided Aluminum PCB:
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