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The heat sinks protrude from the board and require space for the heat to dissipate from them. For that reason, the board must have clearance all around it and cannot be sandwiched between other boards.
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DS200UPSAG1A Data sheet
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That is, the board must have free flowing air around it. Also, when you remove the board from the drive, care must be taken to prevent the heat sinks from hitting other components in the drive.
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Is populated with 3 9-pin connectors, several capacitors, and test points.Also is populated with 3 heat sinks. The heat sinks draw heat from heat producing components on the board.
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Also, the heat sinks may possibly end up broken off the board if they strike a component or structure in the drive.
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Award-winning service
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More than 25 in stock
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Full 12-month warranty
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We deliver worldwide
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sales7@amikon.cn 
86-18965423501 
86-18965423501 
18965423501 
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Schneider:
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Quantum 140 series :Modicon M340
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Modicon Premium :CPU Processor Module,Communication module,etc
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HONEYWELL:
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51 MU MC TC Module card
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ABB:
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DCSTS8001/0(A1810A0810D1810D0810,PM645)S9001/0 10CS(07KT97/98,07AC,07A1,07DI),Bailey(BRC-100)
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FOXBORO:
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FBM203 FBM204 FBM217 FMB231
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TRICONEX:
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3008 3625 3508E 3721 3700A 4351B
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Schneider:
|
Quantum 140 series :Modicon M340
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