Gold
Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers
PCB
(Printed
circuits boards are custom-made products, the picture and parameters shown are
just for reference)
1.1
General description
It's 1.6 mm thick with white
silkscreen(Taiyo) on green solder mask (Taiyo) and Immersion gold on pads. 80
strips of gold fingers are on edge for inserting usage.The base material is
from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
1.2
Features and benefits
1.
High Tg material shows excellent thermal reliability and CAF resistance
providing long-term reliability for industrial and automobile application;
2.
Gold fingers reduce contact resistance;
3.
16000㎡workshop;
4. Meeting
your PCB needs from prototype to mass production.
5. Strict
WIP inspection and monitoring as well as working instruction;
6. IPC
Class 2 / IPC Class 3;
7.
ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
8.
Diversified shipping method: FedEx, DHL, TNT, EMS;
9.
No MOQ, low cost for prototypes and small runs quantity.
1.3
PCB Specifications
|
PCB SIZE
|
150 x
141mm=1PCS
|
|
BOARD TYPE
|
Multilayer PCB
|
|
Number
of Layers
|
8 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 18um(0.5oz)+plate TOP layer
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 35um(1oz) MidLayer 1
|
|
FR-4 0.2mm
|
|
copper ------- 35um(1oz) MidLayer 2
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 35um(1oz) MidLayer 3
|
|
FR-4 0.2mm
|
|
copper ------- 35um(1oz) MidLayer 4
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 35um(1oz) MidLayer 5
|
|
FR-4 0.2mm
|
|
copper ------- 35um(1oz) MidLayer 6
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 18um(0.5oz)+plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
4mil/4mil
|
|
Minimum
/ Maximum Holes:
|
0.35/3.5mm
|
|
Number
of Different Holes:
|
23
|
|
Number
of Drill Holes:
|
183
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control
|
no
|
|
Number
of Gold finger
|
39
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
FR-4,
ITEQ IT-180 TG170℃ er<5.4
|
|
Final
foil external:
|
1oz
|
|
Final
foil internal:
|
1oz
|
|
Final
height of PCB:
|
1.6mm
±0.16
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
on pad, electroplated gold on edge connectors
|
|
Solder
Mask Apply To:
|
TOP and Bottom,
12micron Minimum
|
|
Solder
Mask Color:
|
Gloss Green,
Taiyo PSR-2000GT600D
|
|
Solder
Mask Type:
|
LPSM
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
TOP
and Bottom.
|
|
Colour
of Component Legend
|
White, Taiyo
IJR-4000 MW300
|
|
Manufacturer
Name or Logo:
|
Marked on the
board in a conductor and leged FREE AREA
|
|
VIA
|
Plated
through hole(PTH)
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
1.4
Applications
Bluetooth
Transmitter
HDMI
Splitters
CCTV
Systems
Led
Street Lights
Low
Noise Amplifier
Door
Access Control System
5G
Mobile Hotspot
Multicoupler
Embedded
Systems Development
Smart
Phone and Cell Phone
1.5
Gold finger PCB
The Purpose
is to establish electrical connection to the board without using a two-part
connector system. Plating of nickel and gold is carried out in essentially the
same way as plating copper and tin/lead, i.e., by electrolytic deposition.
Plating can be carried out either manually or automatically. In the manual
process, boards are more or less stationary in the gold plating bath, which
causes a varying gold deposition along the row of contact fingers. The result
will frequently be a thickness distribution with the outermost contact fingers
having perhaps twice as much deposited gold as the center contact fingers. In
the automatic process, gold plating takes place while the boards slide through
the plating cell. The method offers a gold thickness variation that can be
controlled within±5% or better. This is because all contact fingers will be dealt with in exactly
the same way when the board moves through the process cell.
Edge
connectors are frequently provided with a slot that serves to guide the board
with respect to the receptacle (locating slot) and/or to prevent incorrect
insertion of the board (polarization slot). Usually, the PCB manufacturer
prefers to route the slot simultaneously with the contouring of the board.
Obviously, this requires that the slot be slightly wider than the router bit
used.
In
order to ease the insertion of the board into the receptacle, the edge along
the connector should be bevelled. The bevelling also has the advantage of
reducing the scraping of the contacts of the receptacle when the board is inserted
in the receptacle.
BICHENG PCB WORKSHOP:
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BICHENG MAIN COURIERS:
