Heavy
Copper Flexible PCB Built On Polyimide with 2 oz Copper
(Flexible
printed circuits are custom-made products, the picture and parameters shown are
just for reference)
General
description:
It’s a 2
layer polyimide FPC at 0.3mm thick with 2 oz copper. The base laminate is from Shengyi.On
head of its back is 0.1mm FR-4 stiffener. It’s fabricated per IPC 6012 Class 2
using supplied Gerber data. FR-4 as stiffener is applied on the back side.
Parameter
and data sheet:
|
Size of
Flexible PCB
|
130.66 X
40.67mm
|
|
Number of Layers
|
2
|
|
Board Type
|
Flexible PCB
|
|
Board Thickness
|
0.30mm
|
|
Board Material
|
Polyimide
50µm
|
|
Board Material Supplier
|
ITEQ
|
|
Tg Value of Board Material
|
60℃
|
|
|
|
PTH Cu thickness
|
≥20 µm
|
|
Inner Iayer Cu thicknes
|
N/A
|
|
Surface Cu thickness
|
70
µm
|
|
|
|
|
Coverlay Colour
|
Yellow
|
|
Number of Coverlay
|
2
|
|
Thickness of Coverlay
|
25
µm
|
|
Stiffener Material
|
FR-4
|
|
Stiffener Thickness
|
0.2mm
|
|
|
|
|
Type of Silkscreen Ink
|
IJR-4000
MW300
|
|
Supplier of Silkscreen
|
TAIYO
|
|
Color of Silkscreen
|
White
|
|
Number of Silkscreen
|
1
|
|
|
|
Peeling test of Coverlay
|
No
peelable
|
|
Legend Adhesion
|
3M 90℃No
peeling after Min. 3 times test
|
|
|
|
Surface Finish
|
Immersion
Gold
|
|
Thickness of Nickle/Gold
|
Au:
0.03µm(Min.); Ni 2-4µm
|
|
RoHS Required
|
Yes
|
|
Famability
|
94-V0
|
|
|
|
Thermal Shock Test
|
Pass, -25℃±125℃, 1000 cycles.
|
|
Thermal Stress
|
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
|
|
Function
|
100%
Pass electrical test
|
|
Workmanship
|
Compliance
with IPC-A-600H & IPC-6013C Class 2
|
Features
and benefits:
Excellent
flexibility
Reducing
the volume
Weight
reduction
Consistency
of assembly
Increased
reliability
The
end can be whole soldered
Low
cost
Continuity
of processing
On-time
service
Quick
Lead time: 3-5 days
Applications:
General
purpose LED soft light strip, mobile phone antenna flex board, industrial
control, temperature controller soft board
Copper
Foils:
There
are two different types of copper foils: Electro-Deposited (ED) copper foils
and Rolled and annealed (RA) copper foils.
Electro-Deposited
copper foilsare produced by depositing copper on a stainless steel drum that rotates in a
plating tank with anodes of very pure copper. The thickness of the copper foil
is determined by the length of the plating process, i.e. the rotation speed of
the drum. The copper is then removed from the drum and wound on a roll. The finished copper foil is very smooth on the drum side and fairly rough on the
other side. The rough side has the advantage of giving better adhesion to the
base
laminate.
The
main characteristic of ED copper is its grain structure, which is vertical in
nature because of the electrolytic process. This implies a relatively low
ductility of the copper foil, thus it is not recommended for dynamic
applications. The drawing below shows the vertical grain structure of ED
copper.
Common
foil thicknesses for flexible circuits are 17.5, 35, 70, 105 and 175 µm (0.5,
1, 2, 3 and 5 oz.).
RA
Copper
This
copper is a rolled and annealed copper foil produced from electrolytically
deposited cathode copper, which is melted and cast into ingots. The ingots are
first hot-rolled to a certain size, and milled on all surfaces. The copper is
then cold-rolled and annealed, until the desired thickness is obtained.
Contrary
to electro-deposited copper, rolled and annealed copper has a horizontal grain
structure as shown below. The horizontal grain structure provides for much
higher flexibility and a better flex life endurance than ED copper, therefore
RA copper always should be used for dynamic applications.
A
disadvantage of RA copper is that the bonding surface is fairly smooth, so that
a relatively low adhesion is obtained. The bond, however, can be enhanced by an
electrolytic copper flash without deteriorating the flexing characteristics of
the copper foil.
Common
foil thicknesses for flexible circuits are 17.5, 35, 70, 105 and 175 µm (0.5,
1, 2, 3 and 5 oz.)
More
Displays of Heavy Copper Flex:
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