Product Name:High Frequency Microwave Copper Embedded Circuit Board
Description
|
Model
|
BAG014
|
|
Number of layers
|
6L
|
|
Thickness
|
3.0mm
|
|
Minimum aperture
|
0.3mm
|
|
Minimum line width/line spacing
|
0.25mm
|
|
Inner copper thickness
|
1OZ
|
|
Outer copper thickness
|
1OZ+Plating
|
|
Surface treatment
|
Gold ENIG
|
|
Hole to line minimum distance
|
0.2mm
|
Application
Widely used in communication and computer fields,such as high-frequency communication, high-speed transmission, high confidentiality, high transmission quality, and high memory capacity processing.
