Product Name:High Frequency Microwave Copper Substrate Circuit Board
Description
|
Model
|
BAG013
|
|
Number of layers
|
4L+Copper base
|
|
Thickness
|
5.6mm
|
|
Minimum aperture
|
0.35mm
|
|
Minimum line width/line spacing
|
1.25mm
|
|
Inner copper thickness
|
HOZ
|
|
Outer copper thickness
|
1OZ
|
|
Surface treatment
|
Gold ENIG
|
|
Hole to line minimum distance
|
0.185mm
|
Application
Widely used in communication and computer fields,such as high-frequency communication, high-speed transmission, high confidentiality, high transmission quality, and high memory capacity processing.
