High Purity AlN Aluminum Nitride Nanoparticles Used for Ceramic Substrate
The spec for aluminum nitride nanoparticles:
|
Stock #
|
Particle size
|
Purity
|
Morphology
|
|
L522
|
100-200nm
|
99.5%
|
amorphous
|
|
L523
|
300-500nm
|
99.5
|
amorphous
|
|
L528
|
1-2um
|
99.5%
|
Amorphous
|
|
L530
|
5-10um
|
99.5%
|
Amorphous
|
Aluminum nitrides nanoparticles is widely used in ceramic substrate:
1. Aluminum nitride (AlN) ceramic with high thermal conductivity, low coefficient of thermal expansion, high resistance and other characteristics as well as good mechanical properties, is considered the next generation of high-performance ceramic substrate and packaging material of choice,
2. AlN has two very important properties are worthnoting: a high thermal conductivity and a coefficient of expansion of Si arematched. The disadvantage is that even in a very thin surface oxide layer willhave an impact on the thermal conductivity of the materials and processes thatonly strict control in order to create a better consistency of AlN substrates.AlN is still a large-scale domestic production technology immaturity, relativeto Al2O3, AlN many relatively high price, this is a bottleneck restricting itsdevelopment. For these reasons, you can know, alumina ceramic superior overallperformance because the comparison, in the current field of microelectronics,power electronics, hybrid microelectronics, power module or in a dominant position and have been widely used.
3. AlN ceramics with high thermal performance forhigh-power semiconductor substrate, the process of natural cooling in the heatto achieve their goals, but also has good mechanical strength, excellent electrical properties. Although the need to improve domestic manufacturing technology, the price is more expensive, but its annual growth rate of morethan 4 times Al2O3 ceramic, BeO, and can later be replaced by a number of non-oxide ceramics. Do so using AlN ceramic thermal insulation board is ageneral trend, but is there is a time and cost issues.
