High quality thermal conductive graphene platelet powder

CAS No:1034343-98-0

ENINEC No.:231-955-3

Appearance:Black powder

Bulk Density:0.08-0.13g/ml

Lenght:7-10um

Thickness:<100nm




Specification of graphene platelet powder:

Appearance:Black powder
Bulk Density:0.08-0.13g/ml
Lenght:7-10um

Thickness:<100nm


The graphene platelet powder is formed by stacking small-sized graphene microchips, which can greatly improve the lubricating property, mechanical properties, heat resistance and aging resistance of the product, and has high cost performance.

Graphene Nanoplatelets are ultra-thin graphene layered deposits having more than 10 layers of carbon layers and a thickness ranging from 5 to 100 nanometers. The graphene platelet powder maintains the original planar carbon six-membered ring conjugated crystal structure of graphite, and has excellent mechanical strength, electrical conductivity, thermal conductivity, and good lubrication, high temperature resistance and corrosion resistance. Compared to ordinary graphite, the thickness of graphene microchips is in the nanometer scale range.


Note: We can supply different size products of Graphene Nanoplatelets according to client's requirements.

1. Graphene microchips have a narrow distribution of membrane diameters, uniform thickness, and excellent comprehensive properties such as conduction, heat conduction, reinforcement and barrier.
2. The powder bulk density is relatively large and easy to process.
3. The thickness is nanometer and has the characteristics of nano powder.

4. High carbon content, small ash and volatile matter, stable nature, suitable for various processing technologies.


Application of graphene platelet powder:
1. Heat exchange and heat conduction: The composite material modified by graphene microchips not only improves the corrosion resistance of the polymer, but also has good thermal conductivity, and at the same time reduces the thermal expansion coefficient of the composite. Radiator, hot water piping system or heat exchange equipment with corrosive industrial media.
2. Thermal Conductive Elastomers: With the rapid development of high-tech fields such as aviation and electronic appliances, people have put forward more demanding requirements for thermal conductive rubber materials, and expect it to have excellent comprehensive performance. Elastomers modified by graphene microchips, such as gaskets and thermal rubber sheets, provide safe and reliable heat dissipation for the device, as well as sealing and shock absorption.
3. Thermally Conductive Adhesives: As electronic components and electronic devices develop in a thin and light direction, the amount of thermal conductive adhesive used as a sealing and thermal interface material is increasing. Adhesives with graphene microchips are widely used in the thermal and non-insulating fields of chemical heat exchanger bonding, thermal potting, bonding of semiconductor ceramic substrates to thermally conductive substrates.
4. Plastic conductive and antistatic modification: significantly reduce the resistance value of plastic Improve the wear resistance, lubrication and corrosion resistance of plastics
5. Electronics: battery conductive paste, capacitor conductive coating, fuel cell bipolar plate and electrode additives, etc.
6. Container barrier, anti-penetration: fuel tank, oil pipeline, plastic storage tank, elastomer gasket, seal Storage conditions: graphene platelet powder should be sealed and stored in a dry and cool environment. It should not be exposed to the air for a long time, to prevent agglomeration due to moisture, affecting the dispersion performance and use effect, and should avoid heavy pressure, do not contact with oxidant, and transport according to ordinary goods.

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