High Tg Lead Free Multi-layer PCB Built on TU-768 Core and TU-768P Prepreg

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process.





High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

TU-768 / TU-768P laminate / prepreg, these products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.


TU-768 PCB


Main Applications


Consumer Electronics

Server, workstation

Automotive


Key Features


Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance


Our PCB Capability (TU-768)


PCB Material: High-Tg and High Thermal Reliability Epoxy Resin 
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.


High Tg TU-768 PCB


Typical Properties of TU-768


Typical Values Conditioning IPC-4101 /126
Thermal
Tg (DMA) 190°C
Tg (DSC) 180°C > 170°C
Tg (TMA) 170°C E-2/105
Td (TGA) 350°C > 340°C
CTE x-axis 11~15 ppm/°C N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70% < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF
Permittivity (RC 50%) @10GHz 4.3
Loss Tangent (RC 50%) @10GHz 0.018
Electrical
Permittivity (RC50%)
1GHz (SPC method/4291B) 4.4 / 4.3 < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3 N/A
Loss Tangent (RC50%)
1GHz (SPC method/4291B) 0.019 /0.018 < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023 N/A
Volume Resistivity > 1010MΩ•cm C-96/35/90 > 106MΩ•cm
Surface Resistivity > 108MΩ C-96/35/90 > 104MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical
Young’s Modulus
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %


Due to the small size of multilayer PCBs and the placement of SMD components on them, they are usually very light in weight. Due to this lightweight nature, the Multilayer printed circuit board is often used in handheld electronic devices, i.e. medical devices (heartbeat monitors, blood pressure monitors, etc.), mobile phones, electronic watches, etc.


MANUFACTURING PROCESS:


Process PTH PCB


BICHENG PCB WORKSHOP:



BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:



Product Tags Multi-layer High Tg PCB          Multi-layer TU-768 Core PCB          TU-768P Prepreg PCB          TU-768 Core PCB          Lead Free Multi-layer PCB          Multi-layer TU-768 Core PCB         

INQUIRY

Contact us for all information about the product


click here to leave a message

leave a message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.