High
Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With
Immersion Gold
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Brief
Introduction
It
is made on 4 layers copper with 1oz each layer, coating immersion gold and
green solder mask. Final finished thickness is 1.6mm +/- 10%. A panel consists
of 16 pieces.
Typical
Applications
1.
Radio Frequency
2.
Backpanel, High performance computing
3.
Line cards, Storage
4.
Servers, Telecom, Base station
5.
Office Routers
PCB
Specifications
|
Item
|
Description
|
Requirement
|
Actual
|
Result
|
|
1. Laminate
|
Material Type
|
FR-4 TU-872 SLK Sp
|
FR-4 TU-872 SLK Sp
|
ACC
|
|
Tg
|
170℃
|
170℃
|
ACC
|
|
Supplier
|
TU
|
TU
|
ACC
|
|
Thickness
|
1.6±10% mm
|
1.61-1.62mm
|
ACC
|
|
2.Plating thickness
|
Hole Wall
|
≥25µm
|
26.51µm
|
ACC
|
|
Outer copper
|
35µm
|
40.21µm
|
ACC
|
|
Inner Copper
|
30µm
|
31.15µm
|
ACC
|
|
3.Solder mask
|
Material Type
|
Kuangshun
|
Kuangshun
|
ACC
|
|
Color
|
Green
|
Green
|
ACC
|
|
Rigidity (Pencil Test)
|
≥4H or above
|
5H
|
ACC
|
|
S/M Thickness
|
≥10 µm
|
19.55µm
|
ACC
|
|
Location
|
Both Sides
|
Both Sides
|
ACC
|
|
4. Component
Mark
|
Material Type
|
TAIYO/ IJR-4000 MW300
|
IJR-4000 MW300
|
ACC
|
|
Color
|
White
|
White
|
ACC
|
|
Location
|
C/S, S/S
|
C/S, S/S
|
ACC
|
|
5. Peelable Solder Mask
|
Material Type
|
|
|
|
|
Thickness
|
|
|
|
|
Location
|
|
|
|
|
6. Identification
|
UL Mark
|
YES
|
YES
|
ACC
|
|
Date Code
|
WWYY
|
0421
|
ACC
|
|
Mark Location
|
Solder Side
|
Solder Side
|
ACC
|
|
7. Surface Finish
|
Method
|
Immersion Gold
|
Immersion Gold
|
ACC
|
|
Tin Thickness
|
|
|
|
|
Nickel Thickness
|
3-6µm
|
5.27µm
|
ACC
|
|
Gold Thickness
|
0.05µm
|
0.065µm
|
ACC
|
|
8. Normativeness
|
RoHS
|
Directive 2015/863/EU
|
OK
|
ACC
|
|
REACH
|
Directive 1907 /2006
|
OK
|
ACC
|
|
9.Annular Ring
|
Min. Line Width (mil)
|
7mil
|
6.8mil
|
ACC
|
|
Min. Spacing (mil)
|
6mil
|
6.2mil
|
ACC
|
|
10.V-groove
|
Angle
|
30±5º
|
30º
|
ACC
|
|
Residual thickness
|
0.4±0.1mm
|
0.38mm
|
ACC
|
|
11. Beveling
|
Angle
|
|
|
|
|
Height
|
|
|
|
|
12. Function
|
Electrical Test
|
100% PASS
|
100% PASS
|
ACC
|
|
13. Appearance
|
IPC Class Level
|
IPC-A-600J &6012D
Class 2
|
IPC-A-600J &6012D
Class 2
|
ACC
|
|
Visual Inspection
|
IPC-A-600J &6012D Class 2
|
IPC-A-600J &6012D
Class 2
|
ACC
|
|
Warp and Twist
|
≦0.7%
|
0.32%
|
ACC
|
|
14. Reliability Test
|
Tape Test
|
No Peeling
|
OK
|
ACC
|
|
Solvent Test
|
No Peeling
|
OK
|
ACC
|
|
Solderability Test
|
265 ±5℃
|
OK
|
ACC
|
|
Thermal Stress Test
|
288 ±5℃
|
OK
|
ACC
|
|
Ionic Contamination Test
|
≦1.56µg/c㎡
|
0.58µg/c㎡
|
ACC
|
High
Tg PCB
The
thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly
used property is the thermal expansion. When measuring the expansion versus the
temperature, we can get a curve as shown in following picture. The Tg is
determined by the intersection of the tangents of the flat and steep parts of
the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes
to a soft and rubbery state.
For the
most commonly used types of epoxy resin (FR-4 grade), the glass transition
temperature is in the range 115-130°C, so when the board is soldered, the glass
transition temperature is easily exceeded. The board expands in the Z-axis
direction and stresses the copper of the hole wall. The expansion of epoxy
resin is about 15 to 20 times greater than that of copper when exceeding Tg. This
implies a certain risk of wall cracking in plated-through holes, and the more
resin around the hole wall, the greater risk. Below the glass transition
temperature, the expansion ratio between epoxy and copper is only three times,
so here the risk of cracking is negligible.
The Tg of
general board is above 130 celsius degrees, high Tg is generally greater than
170 celsius degrees, medium Tg is about greater than 150 celsius degrees.
PCB boards
with Tg ≥ 170 ° C are usually called high Tg PCBs.
When the glass transition temperature (Tg) exceeds 170 °C,
it is called a high Tg material. High Tg materials have the following
properties: High glass flow temperature value (Tg) High temperature
durability. As a professional high temperature pcb manufacturer, we
provide you with various high quality high temperature PCBs.
Partial
High Tg Material in House
|
Material
|
Tg (℃)
|
Manufacturer
|
|
S1000-2M
|
180
|
Shengyi
|
|
TU-768
|
170
|
TU
|
|
TU-872 SLK Sp
|
170
|
TU
|
|
TU-883
|
170
|
TU
|
|
IT-180ATC
|
175
|
ITEQ
|
|
KB-6167F
|
170
|
KB
|
|
M6
|
185
|
Panasonic
|
|
Kappa 438
|
280
|
Rogers
|
|
RO4350B
|
280
|
Rogers
|
|
RO4003C
|
280
|
Rogers
|
|
RO4730G3
|
280
|
Rogers
|
|
RO4360G2
|
280
|
Rogers
|
High temperature boards are generally defined as boards with a Tg (glass
transition temperature) greater than 170°C. For continuous thermal
loads operating below Tg by about 25°C, high temperature PCBs should
follow a simple rule of thumb. This means, if your product is in the
range of 130°C or higher, High Temperature PCB is recommended.
MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
