High
Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with
Immersion Gold
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description
S1000-2M
is suitable for high
multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to
3oz etc.
Features
Lead-free
compatible FR-4 laminate
Tg170℃
(DSC), UV Blocking/AOI compatible
High
heat resistance
Lower
Z-axis CTE
Excellent
through-hole reliability
Excellent
Anti-CAF performance
Low
water absorption
Excellent
mechanical processability
Applications
Computer
Communication
Automotive
electronics
Suitable
for high layer count PCB
Our
PCB Capability (S1000-2M)
PCB
Material:
|
High Tg, High
Performance and Low CTE Epoxy Resin
|
Designation:
|
S1000-2M
|
Dielectric constant:
|
4.6
at 10GHz
|
Layer count:
|
Double Layer, Multilayer, Hybrid
PCB
|
Copper
weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm), 3oz (105µm)
|
PCB thickness:
|
0.6mm,
0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
|
PCB size:
|
≤400mm X 500mm
|
Solder mask:
|
Green,
Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
|
Technology:
|
HDI, Via in pad, Impedance
Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.
|
General
Properties of S1000-2M
Test
Items
|
Test Method
|
Test Condition
|
Unit
|
Typical Value
|
Tg
|
IPC-TM-650 2.4.24.4
|
DMA
|
℃
|
185
|
IPC-TM-650 2.4.25D
|
DSC
|
℃
|
180
|
Td
|
IPC-TM-650 2.4.24.6
|
TGA (5% W.L)
|
℃
|
355
|
T260
|
IPC-TM-650 2.4.24.1
|
TMA
|
min
|
>60
|
T288
|
IPC-TM-650 2.4.24.1
|
TMA
|
min
|
30
|
T300
|
IPC-TM-650 2.4.24.1
|
TMA
|
min
|
15
|
Thermal
Stress
|
IPC-TM-650 2.4.13.1
|
288℃, solder dip
|
s
|
>100
|
CTE
(Z-axis)
|
IPC-TM-650 2.4.24
|
Before Tg
|
ppm/℃
|
41
|
IPC-TM-650 2.4.24
|
After Tg
|
ppm/℃
|
208
|
IPC-TM-650 2.4.24
|
50-260℃
|
%
|
2.4
|
Permittivity
(1GHz)
|
IPC-TM-650 2.5.5.9
|
C-24/23/50
|
-
|
4.6
|
Loss Tangent
(1GHz)
|
IPC-TM-650 2.5.5.9
|
C-24/23/50
|
-
|
0.018
|
Volume
Resistivity
|
IPC-TM-650 2.5.17.1
|
C-96/35/90
|
MΩ-cm
|
8.7×108
|
Surface
Resistivity
|
IPC-TM-650 2.5.17.1
|
C-96/35/90
|
MΩ
|
2.2×107
|
Arc
Resistance
|
IPC-TM-650 2.5.1
|
D-48/50+D-0.5/23
|
s
|
133
|
Dielectric
Breakdown
|
IPC-TM-650 2.5.6
|
D-48/50+D-0.5/23
|
kV
|
>45
|
Peel Strength
(1oz)
|
IPC-TM-650 2.4.8
|
288℃/10s
|
N/mm [lb/in]
|
1.3 [7.43]
|
Flexural
Strength (LW/CW)
|
IPC-TM-650 2.4.4
|
A
|
Mpa
|
567/442
|
Water
Absorption
|
IPC-TM-650 2.6.2.1
|
D-24/23
|
%
|
0.08
|
Flammability
|
UL94
|
C-48/23/50
|
Rating
|
V-0
|
CTI
|
IEC60112
|
A
|
Rating
|
PLC 3
|
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