High
Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High
Temperature PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Brief
Introduction
There are 10 boards paneled up in the array. They are 1.6mm
thick with 2oz copper, coating with immersion gold on pads and green solder
mask protection for substrate. 25 pieces are vacuum packed for shipment.
Applications
Automotive
(Engine room ECU)
Backplanes
Data
Storage
Server
and Networking
Telecommunications
PCB
Parameters
|
Item
|
Description
|
Requirement
|
Actual
|
Result
|
|
1. Laminate
|
Material Type
|
FR-4 IT-180ATC
|
FR-4 IT-180ATC
|
ACC
|
|
Tg
|
170℃
|
170℃
|
ACC
|
|
Supplier
|
ITEQ
|
ITEQ
|
ACC
|
|
Thickness
|
1.6±10% mm
|
1.63-1.68mm
|
ACC
|
|
2.Plating thickness
|
Hole Wall
|
≥25µm
|
26.51µm
|
ACC
|
|
Outer copper
|
35µm
|
41.09µm
|
ACC
|
|
Inner Copper
|
|
|
|
|
3.Solder mask
|
Material Type
|
TAIYO/ PSR-2000GT600D
|
TAIYO/ PSR-2000GT600D
|
ACC
|
|
Color
|
Green
|
Green
|
ACC
|
|
Rigidity (Pencil Test)
|
≥4H or above
|
5H
|
ACC
|
|
S/M Thickness
|
≥10 µm
|
20.11µm
|
ACC
|
|
Location
|
Both Sides
|
Both Sides
|
ACC
|
|
4. Component
Mark
|
Material Type
|
TAIYO/ IJR-4000 MW300
|
IJR-4000 MW300
|
ACC
|
|
Color
|
White
|
White
|
ACC
|
|
Location
|
C/S
|
C/S
|
ACC
|
|
5. Peelable Solder Mask
|
Material Type
|
|
|
|
|
Thickness
|
|
|
|
|
Location
|
|
|
|
|
6. Identification
|
UL Mark
|
YES
|
YES
|
ACC
|
|
Date Code
|
WWYY
|
2121
|
ACC
|
|
Mark Location
|
Solder Side
|
Solder Side
|
ACC
|
|
7. Surface Finish
|
Method
|
Immersion Gold
|
Immersion Gold
|
ACC
|
|
Tin Thickness
|
|
|
|
|
Nickel Thickness
|
3-6µm
|
4.06µm
|
ACC
|
|
Gold Thickness
|
0.05µm
|
0.056µm
|
ACC
|
|
8. Normativeness
|
RoHS
|
Directive 2015/863/EU
|
OK
|
ACC
|
|
REACH
|
Directive 1907 /2006
|
OK
|
ACC
|
|
9.Annular Ring
|
Min. Line Width (mil)
|
5mil
|
4.8mil
|
ACC
|
|
Min. Spacing (mil)
|
5mil
|
5.2mil
|
ACC
|
|
10.V-groove
|
Angle
|
30º
|
30º
|
ACC
|
|
Residual thickness
|
0.4±0.1mm
|
0.43mm
|
ACC
|
|
11. Beveling
|
Angle
|
|
|
|
|
Height
|
|
|
|
|
12. Function
|
Electrical Test
|
100% PASS
|
100% PASS
|
ACC
|
|
13. Appearance
|
IPC Class Level
|
IPC-A-600J &6012D
Class 2
|
IPC-A-600J &6012D
Class 2
|
ACC
|
|
Visual Inspection
|
IPC-A-600J &6012D Class 2
|
IPC-A-600J &6012D
Class 2
|
ACC
|
|
Warp and Twist
|
≦0.7%
|
0.21%
|
ACC
|
|
14. Reliability Test
|
Tape Test
|
No Peeling
|
OK
|
ACC
|
|
Solvent Test
|
No Peeling
|
OK
|
ACC
|
|
Solderability Test
|
265 ±5℃
|
OK
|
ACC
|
|
Thermal Stress Test
|
288 ±5℃
|
OK
|
ACC
|
|
Ionic Contamination Test
|
≦1.56µg/c㎡
|
0.56µg/c㎡
|
ACC
|
Hole
Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
|
Hole Code
|
PTH
|
Required
|
Actual
value
|
Result
|
|
1
|
Y
|
0.400
|
0.400
|
0.425
|
0.425
|
0.400
|
ACC
|
|
2
|
Y
|
0.450
|
0.450
|
0.500
|
0.475
|
0.450
|
ACC
|
|
3
|
Y
|
0.600
|
0.600
|
0.650
|
0.625
|
0.600
|
ACC
|
|
4
|
Y
|
0.725
|
0.750
|
0.775
|
0.775
|
0.750
|
ACC
|
|
5
|
Y
|
0.850
|
0.850
|
0.825
|
0.850
|
0.825
|
ACC
|
MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
