High Thermal Conductivity Aluminum Nitride Ceramic Substrarte for LED Heat Sink
Product Description:
AlN ceramics have excellent properties such as high thermal conductivity, high strength, high resistivity, low density, low dielectric constant, non-toxic, and thermal expansion coefficient matching Si, which will gradually replace the traditional high-power LED substrate material and become one of the most promising ceramic substrate materials in the future.
LED luminous efficiency and service life will decrease with the increase of junction temperature. In order to keep the LED junction temperature at a lower temperature, high thermal conductivity, low thermal resistance of the thermal substrate material and reasonable packaging process must be used to reduce the overall package thermal resistance of the LED.The role of the LED heat sink substrate is to absorb the heat generated by the chip and conduct it to the heat sink, thus realizing the heat exchange with the outside of the chip.
Our Aluminum Nitride Substrate are available in various sized and thicknesses. Thanks to a large and live inventory. we ship your part fast for you to start your project.
Our Service:
Please contact us for customization. We can also provide AlN ceramic substrate with thermal conductivity to 230W/m.K.
Specification:
Dimensiom(LxW) |
6*6mm |
Thickness |
1mm |
Thermal Conductivity |
170-230 W/m.k |
Dielectric Constant |
8-9(MHz) |
Bulk Density |
3.3 g/m³ |
Surface Roughness |
Ra ≤0.03 μm on both sides |
Company Adavantage:
Huaqing founded in 2004 with sum investment 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop&Euipment:
Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc.