High Thermally Aluminum Nitride Ceramic Substrate AlN Conductive Insulating Sheet

Our aluminum nitride ceramics have outstanding thermal conductivity. It also has a low dielectric constant and has excellent electrical properties comparable to alumina. The thermal expansion rate is similar to that of silicon, and it has high specific strength, low density and non-toxicity.

Product Details:

  1. Material: Aluminum Nitride.
  2. Function: Insulation and heat dissipation.
  3. Type: Ceramic.
  4. Color: Gray.
  5. Can be customed: Yes, please provide drawings of specific products.



High Thermally Aluminum Nitride Ceramic Substrate AlN Conductive Insulating Sheet

Product Description:

AlN ceramics are widely used in various fields of aerospace electronics due to their excellent overall performance. The spacecraft solar cell wing will generate more that tens of kilowatts of electrical power transmission to the interior of the module. According to the requirements of the agency to choose materials, power transmission insulation materials need to have a certain degree of electrical insulation properties and high thermal conductivity, but also need to have excellent mechanical load-bearing capacity.

Therefore, the structure of functional integration materials must be chosen. High thermal conductivity materials need to be selected to conduct the heat gradually accumulated inside to the heat sink to avoid the internal temperature of the component from being too high.Among the high thermal conductivity broadband nitride semiconductor materials, AlN has a thermal conductivity of 320W/(m.K), which is higher than single crystal GaN's 230W/(m.K), and AlN has more heat transfer advantages and GaN in terms of heat conduction.

高功率器件中半导体材料的性能对比

This image is taken from Development on High Thermal Conductive and Electric Insulative AlN Ceramics in Aerospace Devices

Our Aluminum Nitride ceramic substrates are available in various sizes and thickness.

Our Service:

Please contact us for customization.

Specification:

Dimension(LxW) 50.8*50.8mm etc.
Thickness 0.1-10mm
Thermal Conductivity 170-230W/m.K
Dielectric Constant 8-9 (MHz)
Bulk Density 3.3 g/cm³
Surface Roughness Ra < 0.6 μm on both sides

Company Advantage:

Huaqing founded in 2004, with sum investment of 80 million RMB, registered capital 40 million RMB. Huaqing's AlN &Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factoe and excellent mechanical property compared with the other factories in the industry. AlN&Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.

Workshop&Equipment:

Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc.



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