Impedance
Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board
On 2.0mm FR-4
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
1.1
General description
It's a 12-layer board with 2.0 mm
thick. It contains 2+N+2 HDI vias (see the stackup & vias). White
silkscreens (Taiyo) are on green solder mask (Taiyo) and immersion gold on
pads. Both Signal trace impedance and differential pairs impedance are
controlled on layers. See the drawing below. The base material is from ITEQ.
Entire panel is supplying with single up. They're fabricated per IPC 6012 Class
2 using supplied Gerber data. Each 20 boards are packed for shipment.
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Signal Trace Impedance Control
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Trace
Layer
|
Trace Width
(mil)
|
Trace Impedance
(Ohm)
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Precision
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Reference Layer
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Top Layer
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4
|
50
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±10%
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Mid-Layer
1
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L03,
Mid-Layer 2
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4
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50
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±10%
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Mid-Layer
1
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L10, Mid-Layer
9
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4
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50
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±10%
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Mid-Layer
7, Mid-Layer 10
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Bottom Layer
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4
|
50
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±10%
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Mid-Layer
10
|
|
|
|
|
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|
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|
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Differential
Pairs Impedance Control
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Layer
|
Trace Width /
Space (Mil)
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Trace Impedance
(Ohm)
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Precision
|
Frequency (MHz)
|
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Top Layer
|
3.1 / 5.5
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100
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±10%
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Mid-Layer
1
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Top Layer
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4.0 / 5.1
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90
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±10%
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Mid-Layer
1
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L03, Mid-Layer
2
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3.1 / 5.9
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100
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±10%
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Mid-Layer
1, Mid-Layer 4
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L06, Mid-Layer
5
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4.0 / 7.4
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100
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±10%
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Mid-Layer
4, Mid-Layer 6
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L06, Mid-Layer
5
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4.0 / 4.7
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90
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±10%
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Mid-Layer
4, Mid-Layer 6
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L07,
,Mid-Layer 6
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4.0 / 7.4
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100
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±10%
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Mid-Layer
5, Mid-Layer 7
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L07,
,Mid-Layer 6
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4.0 / 4.7
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90
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±10%
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Mid-Layer
5, Mid-Layer 7
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L10, Mid-Layer
9
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3.1 / 5.9
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100
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±10%
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Mid-Layer
7, Mid-Layer 10
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Bottom Layer
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4.0 / 5.5
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100
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±10%
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Mid-Layer
10
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Bottom Layer
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4.0 / 5.1
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90
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±10%
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Mid-Layer
10
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1.2
Features and benefits
Lead
free assemblies with a maximum reflow temperature of 260℃.
Long
storage time ( It can be stored for more than 1 year in vacuum bag)
Improved
the speed of signal transmission
PCB
manufacturing on required specifications.
Quick
and on-time delivery
UL
recognized and RoHS Directive-compliant
Prototype
PCB capability
1.3
Applications
Dsl
Modem
Solar
Battery Charger
Vehicle
Tracker
GPS
Receiver
Wi
Fi Antenna
Bluetooth
USB Hub
USB
Wireless Router
SMS
Modem
Multicoupler
Antenna
Phone
systems
1.4
Parameter and data sheet
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PCB SIZE
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257 x
171.5mm=1PCS=1design
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BOARD TYPE
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Multilayer
PCB
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Number
of Layers
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12 Layers
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Surface
Mount Components
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YES
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Through
Hole Components
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YES
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LAYER STACKUP
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copper
------- TOP 17um(1oz)+plate 25um
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130 um prepreg 1080 x 2
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copper ------- L02 32um(1oz)
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150um core FR-4
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copper ------- L03 18um(0.5oz)
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130 um prepreg 1080 x 2
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copper ------- L04 18um(0.5oz)
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150um core FR-4
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copper ------- L05 18um(0.5oz)
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130 um prepreg 1080 x 2
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copper ------- L06 18um(0.5oz)
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813um core FR-4
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copper ------- L07 18um(0.5oz)
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130 um prepreg 1080 x 2
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copper ------- L08 18um(0.5oz)
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150um core FR-4
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copper ------- L09 18um(0.5oz)
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130 um prepreg 1080 x 2
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copper ------- L10 18um(0.5oz)
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150um core FR-4
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copper ------- L11 35um(1oz)
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130 um prepreg 1080 x 2
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copper ------- BOT 17um(0.5oz)+plate 25um
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TECHNOLOGY
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|
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Minimum Trace and Space:
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4
mil / 4 mil
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Minimum
/ Maximum Holes:
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0.25
mm / 3.0 mm
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Number
of Different Holes:
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26
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Number
of Drill Holes:
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4013
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Number
of Milled Slots:
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0
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Number
of Internal Cutouts:
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0
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Impedance
Control
|
Single Signal
Impedance and Differential Pairs Impedance
|
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BOARD
MATERIAL
|
|
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Glass
Epoxy:
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FR-4, ITEQ IT-180, Tg>175℃, er<5.4
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Final
foil external:
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1oz
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Final
foil internal:
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1oz
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Final
height of PCB:
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2.0mm
±10%
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PLATING AND COATING
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Surface Finish
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Immersion
Gold (ENIG)( 2 µ" over 100 µ" nickel)
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Solder
Mask Apply To:
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Top and Bottom,
12micon Minimum.
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Solder
Mask Color:
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Green,
PSR-2000GT600D, Taiyo supplied.
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Solder
Mask Type:
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LPSM
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CONTOUR/CUTTING
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Routing
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MARKING
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Side of
Component Legend
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TOP
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Colour
of Component Legend
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White, IJR-4000
MW300, Taiyo Supplied.
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Manufacturer
Name or Logo:
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Marked on the
board in a conductor and leged FREE AREA
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VIA
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Plated
Through Hole(PTH), via tented. Vin in
pad under BGA package
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FLAMIBILITY RATING
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UL
94-V0 Approval MIN.
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DIMENSION TOLERANCE
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Outline
dimension:
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0.0059"
(0.15mm)
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Board
plating:
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0.0030"
(0.076mm)
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Drill
tolerance:
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0.002"
(0.05mm)
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TEST
|
100%
Electrical Test prior shipment
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TYPE OF ARTWORK TO BE SUPPLIED
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email
file, Gerber RS-274-X, PCBDOC etc
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SERVICE AREA
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Worldwide,
Globally.
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1.5
Impedance PCB and Impedance Match
The
characteristic impedance of the conductor on the printed circuit board is an
important indicator of the circuit design, especially in the PCB design of high
frequency circuit. Whether the characteristic impedance of the conductor is
consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two
concepts in reliability design of PCB design must be paid attention.
There
will be a variety of signal transmission in the conductor of circuit board. To
increase the rate of transmission, it must increase its frequency. Due to the
factors of the circuit itself such as etching, stack thickness, track width and
so on are different, it will cause changes of the impedance value, resulting in
its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as
the "impedance control". The factors that affect the impedance of the
PCB wiring are mainly the width of the copper track, the thickness of the
copper track, the dielectric constant of the dielectric, the thickness of the
dielectric, the thickness of the pad, the path of the ground layer, the wires
around the wiring, etc. So the impedance of the wiring on the board must be
controlled in the design of the PCB to avoid signal reflection and other
electromagnetic interference and signal integrity issues as far as possible, to
guarantee the stability of the actual use of the PCB board. You can refer to
the corresponding empirical formula for the calculation method of micro-strip
line and strip line impedance on PCB board.
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
