Kappa 438 High Frequency Printed Circuit
Board Rogers 20mil 0.508mm DK 4.38 PCB with Immersion Gold
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Kappa 438 laminates also have the UL 94
V-0 flame retardant rating and are lead free solder process compatible.
Kappa
438 laminates offer dielectric constants (Dk) tailored to FR-4 industry
standard norms which facilities ease of converting existing FR-4 designs where
better electrical performance is needed.
Features:
1.
Glass reinforced hydrocarbon thermoset platform
2.
Dk of 4.38 is tailored to FR-4 industry standard norms
3.
Tighter Dk and thickness tolerance than FR-4
4.
Low Z Axis CTE of 42 ppm/°C
5.
High Tg of > 280°C TMA
6.
Meets UL 94-V0 requirements
Benefits:
1.
Ease of PCB manufacturing and assembly in Line with FR-4
2.
Design Dk enables ease of converting existing FR-4 designs needing better
electrical performance
3.
Consistent circuit performance
4.
Improved design flexibility and plated through-hole reliability
5.
Automated assembly compatible
Typical Applications:
1.
Carrier Grade WiFi/Licensed Assisted Access (LAA)
2.
Small Cell and Distributed Antenna Systems (DAS)
3.
Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4.
Internet of Things (IoT)
Segments:
Smart Home and Wireless Meters
Our PCB Capability (Kappa 438):
|
PCB
Material:
|
Glass
Reinforced Hydrocarbon Ceramic
|
|
Designation:
|
Kappa 438
|
|
Dielectric constant:
|
4.38
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm)
|
|
PCB thickness:
|
20mil (0.508mm), 30mil (0.762mm), 40mil
(1.016mm), 60mil (1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Data Sheet of Kappa 438 Laminate:
|
Property
|
Typical Value
Kappa 438
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant, er Design
|
4.38
|
Z
|
-
|
2.5 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor tan, d
|
0.005
|
Z
|
-
|
10 GHz/23°C
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of Dielectric Constant e
|
-21
|
-
|
ppm/°C
|
10
GHz (-50 to 150°C)
|
Modified IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
2.9
x 109
|
-
|
MΩ•cm
|
COND A
|
IPC-TM-650 2.5.17.1
|
|
Surface
Resistivity
|
6.2
x 107
|
-
|
MΩ
|
COND A
|
IPC-TM-650 2.5.17.1
|
|
Electrical
Strength
|
675
|
Z
|
V/mil
|
-
|
IPC-TM-650 2.5.6.2
|
|
Tensile
Strength
|
16 12
|
MD CMD
|
kpsi
|
-
|
ASTM D3039/D3039-14
|
|
Flexural
Strength
|
25 19
|
MD CMD
|
kpsi
|
-
|
IPC-TM-650 2.4.4
|
|
Dimensional
Stability
|
-0.48-0.59
|
MD CMD
|
mm/m
|
-
|
IPC-TM-650 2.4.39a
|
|
Coefficient of Thermal Expansion
|
13
|
X
|
ppm/°C
|
-55 to 288°C
|
IPC-TM-650 2.4.41
|
|
16
|
Y
|
|
42
|
Z
|
|
Thermal
Conductivity
|
0.64
|
Z
|
W/(m.K)
|
80°C
|
ASTM D5470
|
|
Time to Delamination (T288)
|
>60
|
-
|
minutes
|
288°C
|
IPC-TM-650 2.4.24.1
|
|
Tg
|
>280
|
-
|
°C TMA
|
-
|
IPC-TM-650 2.4.24.3
|
|
Td
|
414
|
-
|
°C
|
-
|
IPC-TM-650 2.3.40
|
|
Moisture
Absorption
|
0.07
|
-
|
%
|
24/23
|
IPC-TM-650 2.6.2.1
|
|
Young’s
Modulus
|
2264
2098
|
MD CMD
|
kpsi
|
-
|
ASTM D3039/D3039-14
|
|
Flex Modulus
|
2337
2123
|
MD CMD
|
kpsi
|
-
|
IPC-TM-650 2.4.4
|
|
Bow
|
0.03
|
-
|
%
|
-
|
IPC-TM-650 2.4.22C
|
|
Twist
|
0.08
|
-
|
%
|
-
|
IPC-TM-650 2.4.22C
|
Copper Peel Strength After Thermal Stress
|
5.8
|
-
|
lbs/in
|
1
oz (35 µm) foil
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
-
|
-
|
-
|
UL 94
|
|
Specific
Gravity
|
1.99
|
-
|
g/cm3
|
-
|
ASTM D792
|
|
Lead-Free Process Compatible
|
Yes
|
-
|
-
|
-
|
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
