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Input Power
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1, Single phase 110/220 VAC, 50 / 60 Hz
2, 1000 W (including vacuum pump and water chiller)
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Power Source
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1, 13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads
2, Load range: 0 – 80 adjustable. Tuning range: -200j – 200j adjustable
3, The rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched “in the plasma” (no breaking of vacuum and plasma during a multilayer process)
4, With a DC power supply, the coater can be easily modified into 1” DC sputtering sources for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurationsC
5, Optional 300 W auto-match RF generator is available at extra cost
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Magnetron Sputtering Head
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1, Three 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps
2, RF cable replacement can be purchased
3, One manually operated shutter is built on the flange
4, One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads
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Sputtering Target
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1, Target size requirement: 1" diameter x 1/8" thickness max
2, Sputtering distance range: 50 – 80 mm adjustable
3, Sputtering angle range: 0 – 25° adjustable
4, 1" diameter Cu target and Al2O3 target are included for demo testing
5, Various oxide 1” sputtering targets are available upon request at extra cost
6, For target bonding, 1 mm and 2 mm copper backing plates are included. Silver epoxy and extra copper backing plates can be ordered
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Vacuum Chamber
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1, Vacuum chamber: 256 mm OD x 238 mm ID x 276 mm Height, made of high purity quartz
2, Sealing flange: 274 mm Dia. made of Aluminum with high-temperature silicone O-ring
3, Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber
4, Max vacuum level: 1.0E-5 Torr with optional turbo pump and chamber baking
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Sample Holder
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1, Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover
2, Sample holder size: 50 mm Dia. for. 2" wafer max
3, Rotation speed: 1 - 10 rpm adjustable for uniform coating
4, The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller
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Vacuum Pump
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1, KF40 vacuum port is built in for connecting to a vacuum pump.
2, Vacuum level: 1.0E-2 Torr with included dual stage mechanical pump
3, 1.0E-5 Torr with optional turbo pump
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Optional
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1, Precision quartz thickness sensor is optional. It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å (water cooling required)
a, Easy USB connection to PC for remote thickness and coating speed monitoring
b, 5 pcs quartz sensors (consumable) are included
2, Remote PC control of the temperature controller is optional
a, Easy USB connection to PC for remote temperature control
b, Temperature control software is included. The module is compatible with LabView
3. For DC magnetron sputtering, turbo pump is recommended
4, Reactive sputtering with N2 or O2 is available with optional gas mixing control station
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Size
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540 mm L x 540 mm W x 1000 mm H
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Net Weight
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60 kg
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Application Notes
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1, This compact 1" RF magnetron sputtering coater is designed for coating oxide thin films on oxide single crystal substrates, which usually does not need high vacuum set-up
2, A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
3, For the best film-substrate adhesion strength, please clean the substrate surface before coating:
a, Ultrasonic cleaning with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
b, Plasma cleaning may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
c, A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys
4, For best performance, the non-conductive targets must be installed with a copper backing plate.
5, OLT supplies single crystal substrate from A to Z
6, OLT RF Plasma Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C
7, Test the flexibility of the thin film/coated electrode with EQ-MBT-12-LD mandrel bending tester.
8, HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF generator before sample loading and target changing operations
9, DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water
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