Low Loss Printed Circuit Board (PCB) onTU-883
SubstrateandTU-883P
Prepreg Multi-layer TU-883 PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description
This material is reinforced with regular woven E-glass and designed with
very low dielectric constant and dissipation factor resin system for high speed
low loss, radio frequency and wireless applications. ThunderClad 2 material is
suitable for environmental protection lead free process and also compatible with
FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture
resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
Applications
Radio
frequency
Backplane,
High performance computing
Line
cards, Storage
Servers,
Telecom, Base station, Office Routers
Performance
and Processing Advantages
Excellent
electrical properties
Dielectric
constant less than 4.0
Dissipation
factor less than 0.005
Stable
and flat Dk/Df performance over frequency and temperature
Compatible
with modified FR-4 processes
Excellent
moisture resistance and Lead Free reflow process compatible
Improved
z-axis thermal expansion
Anti-CAF
capability
Excellent
through-hole and soldering reliability
Halogen
Free
Our
PCB Capabilities (TU-883)
|
PCB
Material:
|
High
Temperature Resin
|
|
Designation:
|
TU-883
|
|
Dielectric constant:
|
3.60
at 1GHz
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid
PCB
|
|
Copper
weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm), 3oz (105µm)
|
|
PCB
thickness:
|
0.5mm,0.6mm,
0.8mm, 1.0mm, 1.2mm, 1.6mm
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green,
Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
|
|
Technology:
|
HDI, Via in pad, Impedance
Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.
|
Typical
Properties of TU-883
|
|
Typical Values
|
Test Condition
|
SPEC
|
|
Thermal
|
|
|
|
|
Tg (DMA)
|
220 °C
|
|
|
|
Tg (TMA)
|
170 °C
|
E-2/105+des
|
N/A
|
|
Td (TGA)
|
420 °C
|
|
|
|
CTE z-axis α1
|
35 ppm/°C
|
Pre-Tg
|
< 60 ppm/°C
|
|
CTE
z-axis α2
|
240 ppm/°C
|
Post-Tg
|
< 300 ppm/°C
|
|
CTE
z-axis
|
2.50%
|
50 to 260°C
|
< 3.0%
|
|
Thermal Stress, Solder Float, 288°C
|
> 60 sec
|
A
|
> 10 sec
|
|
T-260
|
> 60 min
|
|
> 30 min
|
|
T-288
|
> 60 min
|
E-2/105+des
|
> 15 min
|
|
T-300
|
> 60 min
|
|
|
|
Flammability
|
94V-0
|
E-24/125+des
|
94V-0
|
|
Electrical
|
|
|
|
|
Permittivity
(RC63%)
|
|
|
|
|
1GHz (SPC method)
|
3.60
|
|
|
|
5GHz (SPC method)
|
3.58
|
C-24/23/50
|
N/A
|
|
10GHz (SPC method)
|
3.57
|
|
|
|
Loss Tangent (RC63%)
|
|
|
|
|
1GHz (SPC method)
|
0.0030
|
|
|
|
5GHz (SPC method)
|
0.0037
|
C-24/23/50
|
N/A
|
|
10GHz (SPC method)
|
0.0046
|
|
|
|
Volume Resistivity
|
> 1010MΩ•cm
|
C-96/35/90
|
> 106MΩ•cm
|
|
Surface Resistivity
|
> 108MΩ
|
C-96/35/90
|
> 104MΩ
|
|
Electric Strength
|
> 40 KV/mm
|
-
|
> 30 KV/mm
|
|
Dielectric Breakdown Voltage
|
> 50 KV
|
-
|
> 40 KV
|
|
Mechanical
|
|
|
|
|
Young’s
Modulus
|
|
|
|
|
Warp
Direction
|
28 GPa
|
A
|
N/A
|
|
Fill
Direction
|
26 GPa
|
|
|
|
Flexural Strength
|
|
|
|
|
Lengthwise
|
> 60,000 psi
|
A
|
> 60,000 psi
|
|
Crosswise
|
> 50,000 psi
|
A
|
> 50,000 psi
|
|
Peel Strength, 1.0 oz. Cu foil
|
4~6 lb/in
|
A
|
> 4 lb/in
|
|
Water Absorption
|
0.08%
|
E-1/105+des+D-24/23
|
< 0.8 %
|
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