Wafer is a key component in the semiconductor industry. With the rapid development of the semiconductor industry, wafer handling technology has gradually become a key factor restricting the development of the industry. The wafer handling manipulator is one of the core of IC equipment. Its performance directly affects the wafer production efficiency and manufacturing quality, and reflects the automation and reliability of the entire processing system.
There are two types of wafer handling robots in the wafer processing system: FI robot and vacuum robot. The former takes the wafer out of the wafer box and puts it on the pre-alignment equipment. The working environment meets certain requirements for atmospheric cleanliness, and the control accuracy is relatively low. The latter takes the wafer from the pre-alignment equipment, carries it to each station for etching and other process processing, and carries the processed wafer to the interface position, waiting for the atmospheric manipulator to put it back into the wafer box. These technological processes need to be carried out in a vacuum environment. The manipulator must fully meet the vacuum cleanliness requirements, and the control accuracy and reliability requirements are extremely high.
