M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.
Part Numbers:
Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670
Main Features:
Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)
Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)
Lead-free, ROHS-compliant soldering
High heat resistance
M6 also provides excellent high-density interconnect (HDI) and thermal performance.
Our PCB Capabilities (Megtron 6):
PCB Material: |
Low DK Glass Cloth |
Designation: |
Laminate R-5775(G), Prepreg R-5670(G) |
Dielectric constant: |
3.61 at 10GHz |
Dissipation Factor |
0.004 at 10GHz |
Layer count: |
Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Main Applications:
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment,
Measuring instrument,
Super computer,
Typical Value of R-5775:
Property | Units | Test Method | Condition | Typical Value | ||
THERMAL | Glass Transition Temp ( Tg ) | C | DSC | As received | 185 | |
DMA | As received | 210 | ||||
Thermal Decomposition Temp | C | TGA | As received | 410 | ||
Time to Delam (T288) | Without Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | |
With Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | ||
CTE : α1 | X - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | |
Y - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | ||
Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 45 | ||
CTE : α2 | Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | > Tg 260 | 260 | |
ELECTRICAL | Volume Resistivity | MΩ - cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 109 | |
Surface Resistivity | MΩ | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 108 | ||
Dielectric Constant ( Dk ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.71 | |
@ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 3.61 | ||
Dissipation Factor ( Df ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 0.002 | |
@ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 0.004 | ||
PHYSICAL | Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
Peel Strength | 1oz ( H-VLP ) | kN / m | IPC TM-650 2.4.8 | As Received 0.8 | 0.8 | |
Flammability | / | UL | C-48/23/50 | 94V-0 |
Megtron 6 Material List in stock (as of September 2021):
Item |
Thickness (mil) |
Thickness(mm) |
Structure |
Copper weight(oz) |
Type of copper |
R5775G |
2.0 |
0.050 |
1035*1 |
H/H |
HVLP |
R5775G |
2.6 |
0.065 |
1080*1 |
H/H |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
HVLP |
R5775G |
3.9 |
0.100 |
3313*1 |
H/H |
RTF |
R5775G |
3.9 |
0.100 |
3313*1 |
1.0/1.0 |
RTF |
R5775G |
5.9 |
0.150 |
1080*2 |
2.0/2.0 |
RTF |
R5775G |
9.8 |
0.250 |
2116*2 |
H/H |
RTF |
Having more layers within the board allows more circuits and routing for more complex applications. Multilayer PCB Board manufacturing involves laminating more than two conductive layers together, and can have varying numbers of layers, depending on application requirements.



As a high reliability multilayer board manufacturer, we conduct professional Multilayer PCB Board manufacturing. From PCBA manufacturing to complete product assembly, testing and fulfillment, our full range of high-quality services saves you worry, effort and money.
We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.