Metal
Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold
for Radio Device
The PCB made on this kind of modified
material, we can call it metal based high frequency PCB.
Parameters:
DK @
10GHz & Tolerance: 2.20+/- 0.03
Thermal
Change of DK (ppm/℃): -48
Loss
Tangent, Df@10GHz: 0.001
Thermal
Conductivity(W/mk): 0.35
Td(℃): 476
Coefficient
of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density
(g/cm3): 1.80
Volume
Resisivity (Mohm.cm) 1x 10^8
Surface
Resistivity (Mohm): 1 x 10^8
Moisture
Absorption: 0.02
Peel
Strength (N/cm) (1oz): 20
Flammability
Rating: UL94 V0
Modified woven fabric
glass Teflon (PTFE) copper clad laminates with ceramic filler:
Modified woven fabric glass Teflon (PTFE)
copper clad laminates with ceramic filler
|
|
|
|
|
|
|
|
|
|
|
|
|
Designator of Substrate
|
Material Composition / Dielectric Layer
|
Types
|
DK @ 10GHz & Tolerance
|
Thermal Change of Dk(ppm/℃)
|
Loss Tangent, Df@10GHz
|
Thermal Conductivity(W/mk)
|
Td (℃)
|
Coefficient of Thermal Expansion -50℃-260℃(ppm/℃)
|
Density (g/cm3):
|
Volume Resisivity (Mohm.cm)
|
Surface Resistivity (Mohm)
|
Moisture Absorption (%)
|
Peel Strength (N/cm) (1oz)
|
Flammability Rating
|
X
|
Y
|
Z
|
F4BTMS
|
PTFE/Ceramic/Superfine
woven glass
|
F4BTMS220
|
2.20±0.03
|
-48
|
0.0010
|
0.35
|
476
|
40
|
45
|
98
|
1.80
|
1X108
|
1X108
|
0.02
|
20
|
V-0
|
F4BTMS294
|
2.94±0.04
|
-20
|
0.0012
|
0.58
|
490
|
10
|
12
|
22
|
2.25
|
1X108
|
1X108
|
0.03
|
12
|
V-0
|
F4BTMS300
|
3.00±0.04
|
-20
|
0.0013
|
0.58
|
490
|
10
|
11
|
22
|
2.28
|
1X108
|
1X108
|
0.04
|
12
|
V-0
|
Designator
of Substrate
|
Standard
Dielectric Thickness(Without the cladding) and Tolerance
|
Available
Copper Foil
|
Standard Size
|
F4BTMS
|
0.127mm(5mil)
±0.0127mm(0.5mil) 0.254mm(10mil)
±0.02mm(1mil) 0.508mm(20mil)
±0.03mm(1.19mil) 0.762mm(30mil)
±0.04mm(1.58mil) 1.016mm(40mil)
±0.05mm(2mil)
1.524mm(60mil) ±0.05mm(2mil)
3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil)
|
Non-standard
thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact
us.
|
0.5oz,
1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper
|
305mm
x 460mm (12" x 18")
460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x
23.6") 915mm x 1220mm
(36" x 48")
|
PCB Capability:
PCB Capability
|
|
PCB Material:
|
Modified
PTFE Copper Clad with Ceramic Filler
|
|
Designator:
|
F4BTMS220
|
|
Dielectric
constant @ 10GHz:
|
2.2
|
|
|
Layer count:
|
Single Layer
|
|
Copper weight:
|
0.5oz, 1oz
|
|
PCB thickness:
|
1.2mm - 9.0mm
|
|
0.047” - 0.354”
|
|
Solder mask:
|
Green, Red,
Black, White, Blue etc.
|
|
PCB size:
|
≤400mm X 500mm
|
|
Surface finish:
|
Bare copper,
HASL, ENIG, Immersion tin etc.
|
|
BICHENG PCB WORSHOP:
PTFE is a useful material for the fabrication of PCB. Teflon PCB has
its unique advantage of temperature resistance. PTFE PCB Board is a
high-frequency PCB with polytetrafluoroethylene (PTFE) as the PCB
substrate.
MAJOR MATERIAL SUPPLIERS:
Metal core PCB, also known as thermal PCB or metal backplane PCB, is a PCB that uses metal material as the substrate of the heat sink part of the substrate. In Metal Core PCB, thick metal covers one side of the PCB.
PCB surface finish is critical for printed circuit boards because it
prevents copper (exposed traces, pads, holes, and ground planes) from
oxidizing—a key factor in achieving advanced application performance.
Contact us for assistance choosing a finish, such as Tin Surface Finish PCB.
BICHENG PCB CERTIFICATE:
BICHENG MIAN COURIERS: