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Company profile

Fujian Huaqing Electronic Material Technology Co., Ltd, founded in 2004, is a leading domestic supplier of aluminum nitride ceramic substrate materials, the first high-tech enterprise in China to produce aluminum nitride ceramic substrates on a large scale, the national specialized and new “small giant” enterprise, the industry leading enterprise, BAIC investment and SAIC investment, the national manufacturing industry transformation and upgrading fund and the national military civilian integration development fund.

All products

Metalized Direct Bonding Copper(DBC) Al2O3/ZTA Ceramic sheet

Direct Bond Copper (DBC) ceramic substrate is a new type of composite material in which highly insulating Alumina (Al2O3) or Aluminum Nitride (AlN) ceramic substrates are laminated with copper metal. Product Details: Material: Alumina/ZTA/Si3N4. Function: Insulating and heat dissipation ceramic. Type: Metalized ceramic. Can be customed: Yes, please provide drawings of specific products.

Active Metal Brazing(AMB) Ceramic Substrate Used for IGBT Modules

Active Metal Brazing(AMB) substrates rely on a chemical reaction between the ceramic and the active metal solder paste at high temperatures to achieve bonding, which results in higher bond strength and better reliability. Product Details: Material: Aluminum Nitride/ZTA/Si3N4. Function: Insulation and heat dissipation. Type: Metalized Ceramic. Can be customed: Yes, please provide drawings of specific products.

Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules

The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

DBC Ceramic Substrates for Semiconductor

The Direct Bond Copper is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT

DBC ceramic substrate has high thermal conductivity, high current capacity and heat dissipation of the high-purity on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

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