Polyamide Hot-melt Adhesive for Packaging

Polyamide hot-melt adhesive is reacted from dimer acid and diamine. It can be soluble and melt at low temperature, stable at high temperature, has good flexible property.



  • Packing25kg bag
  • Appearancegranular transparent solid
  • Coloryellowish

Performance:

yellowish granular transparent solid. Non-toxic, no stimulation, can be soluble in most organic solvents, non-soluble in water.


Application:

polyamide hot-melt adhesive can be used as adhesive for garments, shoes, leather and electric products seal etc. It is also be used as hot-melt bonding material.     


Specification:

Item   SM-003  
Acid value (mgKOH/g)  5
Amine value (mgKOH/g)  5
Viscosity (mpa.s/200οC)    4500-8000   
Softening point (οC) 155-165
Color (Fe-Co)  8
Shear strength (mpa)  10
Elongation (mpa)  250
Water absorption (%)  0.4
Temperature(οC) 190-200


Packaging:

double layer packing, the outer packing is three-in-one kraft bag and the inner packing is polyethylene plastic bag. Net weight 25kg/bag.
Storage: store in a cool and dry place. 

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