PTFE High Frequency PCB on DK2.65 F4B
0.8mm 1oz Copper With Immersion Gold and Black Solder Mask
Used as
engineering plastic, it can be made into PTFE tube, rod, belt, plate, film and
so on. Generally it’s used in high performance requirements of
corrosion-resistant pipes, containers, pumps, valves as well as radar,
high-frequency communication equipment, radio equipment.
Excellent performance:
1)high temperature resistance: long-term use temperature
200~260 degrees Celsius.
2)low temperature resistance: still soft at -100 degrees
Celsius;
3)corrosion resistance: resistant aqua regia and all organic
solvents;
4)climate resistance: best aging life in plastics;
5)high lubrication: with the smallest friction coefficient in
plastics (0.04);
6)Non-viscous: with minimal surface tension in solid
materials without adhering to any substance;
7)non-toxic: with physiological inertness;
8)excellent electrical properties, ideal for C class of
insulating materials, a thick layer of stack of newspaper can block 1500 V of
high voltage;
9)smoother than ice.
F4BM-1/2 High Frequency PCB
F4BM-1/2 is laminated by laying up
of varnished glass cloth with Teflon resin,according to the scientific formulation and strict technology process. This
product takes some advantages over F4B series in the electrical performance(wider range of dielectric constant、lower dielectric loss angle tangent、increased resistance、and
more stability of performance)
At RF and Microwave frequencies, the dielectric
constant of PTFE materials is as low as 3.5 or below, which keeps strong signal
during transmission across PCB, making them ideal for overcoming the high speed
limitation of FR-4.
PCB Capability (PTFE):
PCB
Material:
|
Fibre glass
coated PTFE
|
Code:
|
F4BM-1/2 (family series)
|
Dielectric constant:
|
2.2, 2.55, 2.65,
|
|
3.0 and 3.5
|
Layer count:
|
1 Layer, 2 Layers and
multi-layer
|
Copper
weight:
|
0.5oz (17 µm), 1oz
(35µm), 2oz (70µm), 3oz (105µm)
|
PCB thickness:
|
0.25mm,
0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm,3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm,
12.0mm
|
PCB size:
|
≤400mm X 500mm
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
Surface
finish:
|
Bare copper, HASL,
ENIG, Silver, OSP,etc.
|
Data Sheet of F4B (PTFE):
Name
|
Test condition
|
Unit
|
Value
|
Density
|
Normal state
|
g/ cm3
|
2.1~2.35
|
Moisture
Absorption
|
Dip in the distilled
water of 20±2℃ for 24
hours
|
%
|
≤0.02
|
Operating
Temperature
|
High-low temperature
chamber
|
℃
|
-50℃~+260℃
|
Thermal
Conductivity
|
|
W/m/k
|
0.8
|
CTE (typical)
|
0~100℃ (εr :2.1~2.3)
|
ppm/℃
|
25(x)
|
34(y)
|
252(z)
|
CTE (typical)
|
0~100℃ (εr :2.3~2.9)
|
ppm/℃
|
14(x)
|
21(y)
|
173(z)
|
CTE (typical)
|
0~100℃ (εr :2.9~3.5)
|
ppm/℃
|
12(x)
|
15(y)
|
95(z)
|
Shrinkage
Factor
|
2 hours in boiling
water
|
%
|
0.0002
|
Surface Resistivity
|
500V DC
|
Normal state
|
M·Ω
|
≥1×104
|
Constant
humidity and temperature
|
≥1×103
|
Volume Resistivity
|
Normal state
|
MΩ.cm
|
≥1×106
|
Constant
humidity and temperature
|
≥1×105
|
Pin Resistance
|
500V DC
|
Normal state
|
MΩ
|
≥1×105
|
Constant humidity and temperature
|
≥1×103
|
Surface dielectric strength
|
Normal state
|
d=1mm(Kv/mm)
|
≥1.2
|
Constant
humidity and temperature
|
≥1.1
|
Dielectric Constant
|
10GHZ
|
εr
|
2.20,2.55,2.65,3.0,3.5 (±2%)
|
Dissipation Factor
|
10GHZ
|
tgδ
|
2.2
|
≤7×10-4
|
2.55~2.65
|
≤1×10-3
|
3.0~3.5
|
≤1.5×10-3
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS: