Quartz Lens View Angle deg 30° UV LED for Printing Curing Wavelenth 365-415nm is made of high-end packaging material Quartz High End Material Package, aluminium nitride substrate, Taiwan Liansheng 46MIL jumbo size chip, and 99.99% pure gold line.
Features:
1. Emitted Color: White.
2. Lens Appearance: Clean quartz lens
3. 3.45x3.45x3.30mm standard package.
4. Suitable for all SMT assembly methods.
5. Compatible with infrared and vapor phase reflow solder process.
6. Compatible with automatic placement equipment.
7. This product doesn’t contain restriction Substance, comply ROHS standard.
Judgment Criteria ofFfailure for the Reliability
Note:
1. U means the upper limit of specified characteristics. S means initial value.
2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient
temperature, then take next measurement.
Lens handling
Please follow the guideline to grab LEDs
1. Use tweezers to grab LEDs
2. Do not touch lens with the tweezers
3. Do not touch lens with fingers
4. Do not apply more than 4N of lens (400g) directly onto the lens
Lens cleaning
In the case where a minimal level of dirt and dust particles can not be guaranteed, a suitable cleaning solution can be applied to the lens surface
1. Try a gentle swabbing using a lint-free swab
2. If needed, the use of lint-free swab and isopropyl alcohol used gently removes dirt from the lens surface
3. Do not use other solvents as they may directly react with the LED assembly
4. Do not use ultrasonic cleaning that the LED will be damaged
Carrier Tape Handling
The following items are recommended when handling the Carrier tape of LEDs
1. Do not twist the carrier tape
2. The inward bending diameter should not smaller than 6cm for carrier tape.
3. Do not bend the tape outward.
4. Storage temperature should not exceed 60℃
Handling :
Care must be taken not to damage LED’s silicon while exposing to high temperature or contact LED’s epoxy resin with hard or sharp objects, such as metal hook, tweezer or sand blasting.
Notes for designing:
Current limiting resistor must be used in the circuit to drive LEDs within the rated figures and not to overload LEDs with instantaneous voltage at the turning ON and OFF cycles.
When using pulse driving, the average current must be within the rated figures. And the circuit should be designed to avoid reverse voltage when turning off the LEDs.
Storage:
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:
a. Completed within 168 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if: (2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃.
