RESIN BOND POLISHING PAD FOR CERAMIC DIA.100MM
DESCRPITION:
This resin bond polishing pad is specialized designed for polishing ceramic. Grits from 50# to 3000# are available.
SPECIFICATIONS:
Material: Resin + Diamond powder
Type: polishing pad
Available diameter: 4”(100mm)
Available grits: 50# 100# 200# 400# 800# 1500# 3000#
Working thickness: 5mm
Connection: Hook and Loop
Application: for polishing ceramic
Machine: Angle grinder
