RF-60A
25mil (0.635mm) Taconic High Frequency PCB With Immersion Ni/Au For Filters
& Couplers
RF-60A based on woven glass reinforcement. It is a result of Taconic's
expertise in both ceramic fill technology and in coated PTFE fiberglass. RF-60A
exhibits exceptional interlaminar bond strength and solder resistance. Its
proprietary composition results in low moisture absorption and uniform
electrical properties.
RF-60A's
woven glass reinforcement ensures excellent dimentional stability and enhances
flexural strength. It exhibits low Z-axis expansion allowing for
plated-through-hole reliablity in extreme thermal environments. With a
dielectric constant of approximately 6.15, it is ideal high DK products for
applications requiring reduced circuit size and weight. The low electrical loss
factor makes it an excellent selection for RF circuits.
RF-60A
laminates are in complete compliance with RoHS and WEEE directives and are
compatible with the temperatures required for the new lead free solders. They
can be sheared, drilled, milled and plated using standard methods for
PTFE-woven fiberglass materials, so mass production becomes possible.
Our
PCB Capabilities (RF-60A):
|
PCB
Material:
|
Organic-ceramic
Woven Fiberglass Reinforced Laminates
|
|
Designation:
|
RF-60A
|
|
Dielectric constant:
|
6.15 ±0.25
|
|
Dissipation Factor
|
DF 0.0038@10 GHz
|
|
Thermal Conductivity
|
0.4 W/MK
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm),
125mil (3.175mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP, Immersion tin etc..
|
Benefits
(in general):
Low Moisture
Absorption
Stable
DK over Frequency
Dimensionally
Stable
Low
Z-axis Expansion
High
Flexural Strength
Exceptional
Interlaminar Bonds
Typical
Applications:
Power
Amplifiers
Filters
& Couplers
Passive
Components
Antennas
Data
Sheet of Taconic RF-60A:
|
RF-60A
Typical Values
|
|
Property
|
Test Method
|
Unit
|
Value
|
Unit
|
Value
|
|
Dk @ 10 GHz
|
IPC-650
2.5.5.6
|
|
6.15
|
|
6.15
|
|
Df @ 10 GHz
|
IPC-650
2.5.5.5.1
|
|
0.0038
|
|
0.0038
|
|
Moisture
Absorption
|
IPC-650
2.6.2.1
|
%
|
0.02
|
%
|
0.02
|
|
Dielectric
Breakdown
|
IPC-650
2.5.6
|
kV
|
53
|
kV
|
53
|
|
Dielectric
Strength
|
ASTM
D 149
|
V/mil
|
880
|
kV/mm
|
35
|
|
Volume
Resistivity
|
IPC-650
2.5.17.1 (After Humidity)
|
Mohm/cm
|
9.0
x 108
|
Mohm/cm
|
9.0
x 108
|
|
Surface
Resistivity
|
IPC-650
2.5.17.1 (After Humidity)
|
Mohm
|
2.28
x 108
|
Mohm
|
2.28
x 108
|
|
Arc Resistance
|
IPC-650
2.5.1
|
Seconds
|
193
|
Seconds
|
193
|
|
Flexural
Strength (MD)
|
ASTM
D 790
|
psi
|
18,300
|
N/mm2
|
126.2
|
|
Flexural
Strength (CD)
|
ASTM
D 790
|
psi
|
14,600
|
N/mm2
|
100.7
|
|
Tensile
Strength (MD)
|
ASTM
D 3039
|
psi
|
19,500
|
N/mm2
|
134.4
|
|
Tensile
Strength (CD)
|
ASTM
D 3039
|
psi
|
16,300
|
N/mm2
|
112.4
|
|
Young’s
Modulus
|
ASTM
D 3039
|
kpsi
|
1,590
|
N/mm2
|
11,000
|
|
Poisson’s
Ratio
|
ASTM
D 3039
|
|
0.068
|
N/mm2
|
0.068
|
|
Compressive
Modulus
|
ASTM
D 695 (23°C)
|
kpsi
|
338
|
|
2,330
|
|
Peel Strength
(1 oz. ED)
|
IPC-650
2.4.8 Sec. 5.2.2 (Thermal Stress)
|
lbs/in
|
8
|
N/mm
|
1.4
|
|
Dimensional
Stability (MD)
|
IPC-650
2.4.39 Sec. 5.4 (After Bake)
|
mils/in
|
0.68
|
mm/M
|
0.68
|
|
Dimensional
Stability (CD)
|
IPC-650
2.4.39 Sec. 5.4 (After Bake)
|
mils/in
|
1.05
|
mm/M
|
1.05
|
|
Density
(Specific Gravity)
|
ASTM
D 792
|
g/cm3
|
2.79
|
g/cm3
|
2.79
|
|
Thermal
Conductivity
|
ASTM
F 433
|
W/M*K
|
0.4
|
W/M*K
|
0.4
|
|
CTE (X axis)
|
ASTM
D 3386 (-30°C - 125°C)
|
ppm/°C
|
9
|
ppm/°C
|
9
|
|
CTE (Y axis)
|
ASTM
D 3386 (-30°C - 125°C)
|
ppm/°C
|
8
|
ppm/°C
|
8
|
|
CTE (Z axis)
|
ASTM
D 3386 (-30°C - 125°C)
|
ppm/°C
|
69
|
ppm/°C
|
69
|
|
Outgassing (%
TML)
|
ASTM
E 595*
|
%
|
0.02
|
%
|
0.02
|
|
Outgassing (%
CVCM)
|
ASTM
E 595*
|
%
|
0.00
|
%
|
0.00
|
|
Outgassing (%
WVR)
|
ASTM
E 595*
|
%
|
0.01
|
%
|
0.01
|
|
Flammability
Rating
|
UL
94
|
|
V-0
|
|
V-0
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
