RF
PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with
Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
RF-60TC
is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the
PCB of high power RF and microwave applications. It is designed to provide
lower operating temperature in high power applications and the 6.15DK market.
RF-60TC's
enhanced heat transfer function allows additional design margin to extend the
life of active components and improve long-term reliability.
RF-60TC
with extremely low profile and reverse treated copper is excellent to reduce
insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE
and improved dimensional stability make it possible to build multi-layer PCB
with improved PTH reliability.
Our
PCB Capability (RF-60TC):
|
PCB
Material:
|
PTFE based,
ceramic filled fiberglass
|
|
Designation:
|
RF-60TC
|
|
Dielectric constant:
|
6.15
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm)
|
|
PCB thickness:
|
10mil (0.254mm); 20mil (0.508mm),
25mil(0.635mm); 30mil (0.762mm), 60mil
(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..
|
Benefits:
1.Improved loss tangent
-
Lower insertion loss
-
Enhanced antenna gain / efficiency
2.High thermal conductivity
-
Exceptional thermal management
-
Lower operating temperature
-
Higher power application
-
Loong term reliablity
3.Enhanced dimensional stability
4.Low Z-axis CTE
-
Multilayer application available
- Reliable
plated through hole
5.Excellent adhesion to metal
-
Lower profile copper available
-
Heavy metal back available
6.Stable DK over frequency
7.Stable DK over temperature
8.Low moisture absorption
Applications:
High
power amplifier
Miniaturized
antennas (GPS / PATCH / RFID Reader)
Filters,
couplers, dividers
Satellites
Typical
Value of RF-60TC:
|
RF-60TC
Typical Values
|
|
Property
|
Test Method
|
Unit
|
Value
|
Unit
|
Value
|
|
Dk @ 10 GHz
|
IPC-650 2.5.5.5.1(Modified)
|
|
6.15 ± 0.15
|
|
6.15 ± 0.15
|
|
Df @ 10 GHz
|
IPC-650 2.5.5.5.1(Modified)
|
|
0.002
|
|
0.002
|
|
TcK
|
|
ppm/°C
|
-3.581
|
ppm/°C
|
-3.581
|
|
Dielectric
Breakdown
|
IPC-650 2.5.6
|
kV
|
55
|
kV
|
55
|
|
Dielectric
Strength
|
IPC-650 2.5.6.2
|
V/mil
|
550
|
V/mm
|
21,654
|
|
Arc Resistance
|
IPC-650 2.5.1
|
Seconds
|
>180
|
Seconds
|
>180
|
|
Moisture
Absorption
|
IPC-650 2.6.2.1
|
%
|
0.03
|
%
|
0.03
|
|
Flexural
Strength(MD)
|
IPC-650 2.4.4
|
psi
|
10,000
|
N/mm2
|
69
|
|
Flexural
Strength(CD)
|
IPC-650 2.4.4
|
psi
|
9,000
|
N/mm2
|
62
|
|
Tensile
Strength(MD)
|
IPC-650 2.4.19
|
psi
|
9,000
|
N/mm2
|
62
|
|
Tensile
Strength(CD)
|
IPC-650 2.4.19
|
psi
|
7,000
|
N/mm2
|
48
|
|
Young’s
Modulus(MD)
|
ASTM D
3039/IPC-TM-650 2.4.19
|
kpsi
|
721
|
N/mm2
|
4971
|
|
Poisson’s
Ratio(MD)
|
ASTM D
3039/IPC-TM-650 2.4.19
|
|
0.155
|
|
0.155
|
|
Peel Strength(1 oz. ED)
|
IPC-650 2.4.8
|
lbs/in
|
8
|
N/mm
|
1.43
|
|
Thermal
Conductivity(Unclad)
|
IPC-650 2.4.50
|
W/M*K
|
0.9
|
W/M*K
|
0.9
|
|
Thermal
Conductivity(CH/CH)
|
IPC-650 2.4.50
|
W/M*K
|
1
|
W/M*K
|
1
|
|
Thermal
Conductivity(C1/C1)
|
IPC-650 2.4.50
|
W/M*K
|
1.05
|
W/M*K
|
1.05
|
|
Dimensional
Stability(MD)
|
IPC-650 2.4.39 Sec.
5.4(After Bake)
|
mils/in
|
0.01
|
mm/M
|
0.01
|
|
Dimensional
Stability(CD)
|
IPC-650 2.4.39 Sec.
5.4(After Bake)
|
mils/in
|
0.69
|
mm/M
|
0.69
|
|
Dimensional
Stability(MD)
|
IPC-650 2.4.39 Sec.
5.5(Thermal Stress)
|
mils/in
|
0.06
|
mm/M
|
0.06
|
|
Dimensional
Stability(CD)
|
IPC-650 2.4.39 Sec.
5.5(Thermal Stress)
|
mils/in
|
0.8
|
mm/M
|
0.8
|
|
Surface
Resistivity
|
IPC-650 2.5.17.1(After Humidity)
|
Mohm
|
1.0 x 108
|
Mohm
|
1.0 x 108
|
|
Volume
Resistivity
|
IPC-650 2.5.17.1(After Humidity)
|
Mohm/cm
|
1.0 x 108
|
Mohm/cm
|
1.0 x 108
|
|
CTE(X, Y axis)
|
IPC-650 2.4.41(RT- 150°C)
|
ppm/°C
|
9.9
|
ppm/°C
|
9.9
|
|
CTE(Z axis)
|
IPC-650 2.4.41(RT- 150°C)
|
ppm/°C
|
40
|
ppm/°C
|
40
|
|
Density(Specific Gravity)
|
IPC-650 2.3.5
|
g/cm3
|
2.84
|
g/cm3
|
2.84
|
|
Specific Heat
|
IPC-650 2.4.50
|
J/gK
|
0.94
|
J/gK
|
0.94
|
|
Td(2% Wt. Loss)
|
IPC - 650 2.4.24.6 /
TGA
|
°F
|
930
|
°C
|
500
|
|
Td(5% Wt. Loss)
|
IPC - 650 2.4.24.6 /
TGA
|
°F
|
960
|
°C
|
515
|
|
Flammability
Rating
|
UL 94
|
|
V-0
|
|
V-0
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAJOR MATERIAL SUPPLIER:
