RO4003C
LoPro PCB Rogers 12.7mil Reverse Treated Foil (RTF) Circuit Board for High
Speed Back Planes.
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
RO4003C
LoPro laminates results in a laminate
with low conductor loss for improved insertion loss and signal integrity while
maintaining all other desirable attributes of the standard RO4003C laminate
system.
Features
and Benefits:
RO4003C
materials are reinforced hydrocarbon/ceramic laminates with very low profile
reverse treated foil.
1.
Lower insertion loss
2.
Low PIM
3.
Increased signal integrity
4. High
circuit density
Low
Z-axis coefficient of thermal expansion
1.
Multi-layer board capability
2. Design
flexibility
Lead-free
process compatible
1.High temperature processing
2.Meets environmental concerns
CAF
resistant
Our
PCB Capability (RO4003C LoPro)
|
PCB
Material:
|
Hydrocarbon
Ceramic Laminates
|
|
Designation:
|
RO4003C LoPro
|
|
Dielectric constant:
|
3.38±0.05
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
12.7mil
(0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm),
60.7mil(1.542mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP, Immersion tin etc..
|
Typical
Properties of RO4003C LoPro
|
Property
|
Typical Value
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant, Process
|
3.38
± 0.05
|
z
|
--
|
10
GHz/23°C
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric Constant, Design
|
3.5
|
z
|
--
|
8
to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor tan,d
|
0.0027
0.0021
|
z
|
--
|
10
GHz/23°C 2.5 GHz/23°C
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coeffifi cient ofer
|
40
|
z
|
ppm/°C
|
-50°C
to 150°C
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.7 X 1010
|
|
MΩ•cm
|
COND
A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
4.2 X 109
|
|
MΩ
|
COND
A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
z
|
KV/mm(V/mil)
|
0.51mm(0.020”)
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
26889(3900)
|
Y
|
MPa(kpsi)
|
RT
|
ASTM
D638
|
|
Tensile Strength
|
141(20.4)
|
Y
|
MPa(kpsi)
|
RT
|
ASTM
D638
|
|
Flexural
Strength
|
276(40)
|
|
MPa(kpsi)
|
|
IPC-TM-650 2.4.4
|
|
Dimensional Stability
|
<0.3
|
X,Y
|
mm/m(mils/inch)
|
after
etch +E2/150°C
|
IPC-TM-650
2.4.39A
|
|
Coeffifi cient of Thermal Expansion
|
11
|
x
|
ppm/°C
|
-55 to
288°C
|
IPC-TM-650
2.1.41
|
|
14
|
y
|
|
46
|
z
|
|
Tg
|
>280
|
|
°C
TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
425
|
|
°C
TGA
|
|
ASTM
D3850
|
|
Thermal Conductivity
|
0.64
|
|
W/m/°K
|
80°C
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48
hrs immersion 0.060” sample Temperature 50°C
|
ASTM
D570
|
|
Density
|
1.79
|
|
gm/cm3
|
23°C
|
ASTM
D792
|
|
Copper Peel Strength
|
1.05(6.0)
|
|
N/mm(pli)
|
after
solder float 1 oz. TC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
N/A
|
|
|
|
UL
94
|
|
Lead-Free Process Compatible
|
Yes
|
|
|
|
|
Typical applications are as follows:
MANUFACTURING PROCESS:
BICEHNG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:
