Rogers
15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for
Chip Testers
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
The electrical and mechanical properties
of TMM10 laminates combine many of the benefits of both ceramic and traditional
PTFE microwave circuit laminates, without requiring the specialized production
techniques common to these materials.
TMM10 laminates have an exceptionally
low thermal coefficient of dielectric constant, typically less than 30 ppm/°C.
The material’s isotropic coefficients of thermal expansion, very closely
matched to copper, allow for production of high reliability plated through
holes, and low etch shrinkage values. Furthermore, the thermal conductivity of
TMM10 laminates is approximately twice that of traditional PTFE/ceramic
laminates, facilitating heat removal.
TMM10 laminates are based on thermoset
resins, and do not soften when heated. As a result, wire bonding of component
leads to circuit traces can be performed without concerns of pad lifting or
substrate deformation.
Some Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our Capabilities (TMM10):
|
PCB
Material:
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Ceramic,
Hydrocarbon, Thermoset Polymer Composites
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Designation:
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TMM10
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Dielectric constant:
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9.20 ±0.23
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Layer count:
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Double Layer, Multilayer, Hybrid PCB
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Copper
weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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PCB thickness:
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15mil (0.381mm), 20mil (0.508mm), 25mil
(0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm),
100mil (2.54mm), 125mil (3.175mm),
150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm),
500mil (12.70mm)
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|
PCB size:
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≤400mm X 500mm
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|
Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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Surface
finish:
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Bare copper, HASL,
ENIG, OSP etc..
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Data Sheet of TMM10:
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TMM10
Typical Value
|
|
Property
|
|
TMM10
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Direction
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Units
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Condition
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Test Method
|
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Dielectric Constant,εProcess
|
9.20±0.23
|
Z
|
|
10 GHz
|
IPC-TM-650
2.5.5.5
|
|
Dielectric Constant,εDesign
|
9.8
|
-
|
-
|
8GHz to 40 GHz
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Differential
Phase Length Method
|
|
Dissipation Factor (process)
|
0.0022
|
Z
|
-
|
10
GHz
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of dielectric constant
|
-38
|
-
|
ppm/°K
|
-55℃-125℃
|
IPC-TM-650
2.5.5.5
|
|
Insulation Resistance
|
>2000
|
-
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Gohm
|
C/96/60/95
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ASTM
D257
|
|
Volume Resistivity
|
2 x 108
|
-
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Mohm.cm
|
-
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ASTM
D257
|
|
Surface Resistivity
|
4 x 107
|
-
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Mohm
|
-
|
ASTM
D257
|
|
Electrical
Strength(dielectric strength)
|
285
|
Z
|
V/mil
|
-
|
IPC-TM-650
method 2.5.6.2
|
|
Thermal Properties
|
|
Decompositioin Temperature(Td)
|
425
|
425
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℃TGA
|
-
|
ASTM D3850
|
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Coefficient of Thermal Expansion - x
|
21
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X
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ppm/K
|
0 to 140℃
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ASTM E 831
IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Y
|
21
|
Y
|
ppm/K
|
0
to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Z
|
20
|
Z
|
ppm/K
|
0
to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Thermal Conductivity
|
0.76
|
Z
|
W/m/K
|
80℃
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ASTM
C518
|
|
Mechanical Properties
|
|
Copper Peel Strength after Thermal Stress
|
5.0 (0.9)
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X,Y
|
lb/inch (N/mm)
|
after solder float 1 oz. EDC
|
IPC-TM-650
Method 2.4.8
|
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Flexural Strength (MD/CMD)
|
13.62
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X,Y
|
kpsi
|
A
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ASTM
D790
|
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Flexural Modulus (MD/CMD)
|
1.79
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X,Y
|
Mpsi
|
A
|
ASTM
D790
|
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Physical Properties
|
|
Moisture Absorption (2X2)
|
1.27mm
(0.050")
|
0.09
|
-
|
%
|
D/24/23
|
ASTM D570
|
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3.18mm (0.125")
|
0.2
|
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Specific Gravity
|
2.77
|
-
|
-
|
A
|
ASTM
D792
|
|
Specific Heat Capacity
|
0.74
|
-
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J/g/K
|
A
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Calculated
|
|
Lead-Free Process Compatible
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YES
|
-
|
-
|
-
|
-
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PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
