Rogers 6006
High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion Gold and Green
Mask for Ground Radar Warning
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Hi Guys,
Today we’re going to talk about Rogers 6006
PCB.
Rogers RT/duroid 6006 microwave laminates are
ceramic-PTFE composites which are designed for electronic and microwave circuit
applications requiring a high dielectric constant. RT/duroid 6006 laminate is
available with a dielectric constant value of 6.15.
PCB Capability (RT/duroid 6006):
|
PCB Material:
|
Ceramic-PTFE
composite
|
|
Designator:
|
RT/duroid 6006
|
|
Dielectric
constant:
|
6.15 ±0.15 (process)
|
|
6.45 (design)
|
|
Layer count:
|
1 Layer, 2 Layer
|
|
Copper weight:
|
0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil (0.254mm),
25mil (0.635mm)
|
|
50mil (1.27mm),
75mil (1.90mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black,
Blue, Yellow, Red etc.
|
|
Surface finish:
|
Bare copper,
HASL, ENIG, Immersion Tin, Immersion Silver and OSP.
|
RT/duroid 6006 microwave laminates feature ease
of fabrication and stability in use. This property results in the possibility
of mass production and reducing the cost of goods.
Features and Benefits:
|
1. High
dielectric constant for circuit size reduction
|
|
2. Low loss.
Ideal for operating at X-bank or below
|
|
3. Tight DK and
thickness control for repeatable circuit performance
|
The typical applications are aircraft collision
avoidance systems, ground radar warning systems, patch antennas, satellite
communications systems etc.
Thank you for your reading.
Appendix: Properties of RT/duroid 6006
laminates:
|
RT/duroid
6006 Typical Value
|
|
Property
|
RT/duroid 6006
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
6.15±0.15
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped stripline
|
|
Dielectric Constant,εDesign
|
6.45
|
Z
|
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor,tanδ
|
0.0027
|
Z
|
|
10
GHz/A
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
-410
|
Z
|
ppm/℃
|
-50℃-170℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
7 x 107
|
|
Mohm.cm
|
A
|
IPC
2.5.17.1
|
|
Surface Resistivity
|
2 x 107
|
|
Mohm
|
A
|
IPC
2.5.17.1
|
|
Tensile Properties
|
ASTM D638 (0.1/min. strain rate)
|
|
Young's Modulus
|
627(91) 517(75)
|
X Y
|
MPa(kpsi)
|
A
|
|
Ultimate Stress
|
20(2.8) 17(2.5)
|
X Y
|
MPa(kpsi)
|
A
|
|
Ultimate Strain
|
12
to 13 4 to 6
|
X Y
|
%
|
A
|
|
Compressive Properties
|
|
ASTM D695 (0.05/min. strain rate)
|
|
Young's Modulus
|
1069
(115)
|
Z
|
MPa(kpsi)
|
A
|
|
Ultimate Stress
|
54(7.9)
|
Z
|
MPa(kpsi)
|
A
|
|
Ultimate Strain
|
33
|
Z
|
%
|
|
|
Flexural Modulus
|
2634
(382) 1951 (283)
|
X
|
MPa(kpsi)
|
A
|
ASTM D790
|
|
Ultimate Stress
|
38
(5.5)
|
X Y
|
MPa(kpsi)
|
A
|
|
Deformation under load
|
0.33 2.1
|
Z Z
|
%
|
24hr/50℃/7MPa 24hr/150℃/7MPa
|
ASTM
D261
|
|
Moisture Absorption
|
0.05
|
|
%
|
D48/50℃0.050"(1.27mm) thick
|
IPC-TM-650
2.6.2.1
|
|
Thermal Conductivity
|
0.49
|
|
W/m/k
|
80℃
|
ASTM
C518
|
Coefficient of Thermal Expansion
|
47
34
117
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650
2.4.41
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM
D3850
|
|
Density
|
2.7
|
|
g/cm3
|
|
ASTM
D792
|
|
Specific Heat
|
0.97(0.231)
|
|
j/g/k
(BTU/ib/OF)
|
|
Calculated
|
|
Copper Peel
|
14.3 (2.5)
|
|
pli (N/mm)
|
after solder float
|
IPC-TM-650
2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
