Rogers
6035 High Frequency PCB Built On Double Sided 20mil Core With Immersion Gold for
Power Amplifiers
RT/duroid
6035HTC high frequency circuit materials of Rogers Corporation are ceramic
filled PTFE composites for use in high power RF and microwave applications.
With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000
products, and
copper
foil (electrodeposited and reverse treat) with excellent long term thermal
stability, RT/duroid 6035HTC laminates are an exceptional choice for high power
applications.
Features/Benefits:
1.
High Thermal conductivity
Improved
dielectric heat dissipation enables lower operating temperatures for high power
applications
2.
Low loss tangent
Excellent
high frequency performance
3.
Thermally stable low profile and reverse treat copper foil
Lower
insertion loss and excellent thermal stability of traces
4.
Advanced filler system
Improved
drill ability and extended tool life compared to alumina containing circuit
materials
Some
Typical Applications:
1.
High Power RF and Microwave Amplifiers
2.
Power Amplifiers, Couplers, Filters
3.
Combiners, Power Dividers
PCB
Capability（RT/duroid 6035HTC）:
|
PCB
Material:
|
Ceramic-filled
PTFE composites
|
|
Designation:
|
RT/duroid 6035HTC
|
|
Dielectric constant:
|
3.50±0.05
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Data
Sheet of RT/duroid 6035HTC:
|
RT/duroid
6035HTC Typical Value
|
|
Property
|
RT/duorid 6035HTC
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.50±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.6
|
Z
|
|
8 GHz - 40
GHz
|
Differential Phase Length Method
|
|
Dissipation
Factor
|
0.0013
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of ε
|
-66
|
Z
|
ppm/℃
|
-50℃to 150℃
|
mod IPC-TM-650, 2.5.5.5
|
|
Volume Resistivity
|
108
|
|
MΩ.cm
|
A
|
IPC-TM-650, 2.5.17.1
|
|
Surface Resistivity
|
108
|
|
MΩ
|
A
|
IPC-TM-650, 2.5.17.1
|
|
Dimensional Stability
|
-0.11 -0.08
|
CMD MD
|
mm/m
(mils/inch)
|
0.030"
1oz EDC foil Thickness after etch '+E4/105
|
IPC-TM-650 2.4.39A
|
|
Tensile Modulus
|
329 244
|
MD CMD
|
kpsi
|
40 hrs @23℃/50RH
|
ASTM D638
|
|
Moisure Absorption
|
0.06
|
|
%
|
D24/23
|
IPC-TM-650 2.6.2.1 ASTM D570
|
Coefficient of Thermal Expansion (-50℃to 288℃)
|
19 19 39
|
X Y Z
|
ppm/℃
|
23℃/ 50% RH
|
IPC-TM-650 2.4.41
|
|
Thermal Conductivity
|
1.44
|
|
W/m/k
|
80℃
|
ASTM C518
|
|
Density
|
2.2
|
|
gm/cm3
|
23℃
|
ASTM D792
|
|
Copper Peel Stength
|
7.9
|
|
pli
|
20 sec. @288℃
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-Free Process Compatible
|
Yes
|
|
|
|
|
High frequency PCBs are widely used in applications involving special
signal transmission between objects. It has a frequency range of 500MHz
to 2GHz and is ideal for mobile, microwave, RF and high-speed design
applications. As a leading high frequency pcb manufacturer in China, it
is committed to selling high-quality products at the lowest price.
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
