High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB
RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.
The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range.
RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions.
The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.
RO4350B
PCB Specifications：
|
PCB SIZE
|
135 x
135mm=1PCS
|
|
BOARD TYPE
|
High
frequency PCB, RF PCB
|
|
Number
of Layers
|
Double sided PCB
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 35um(1oz)+PLATE
|
|
RO4350B 60mil
|
|
copper ------- 35um(1oz)+PLATE
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
11mil/12mil
|
|
Minimum
/ Maximum Holes:
|
0.3/2.2mm
|
|
Number
of Different Holes:
|
5
|
|
Number
of Drill Holes:
|
184
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control
|
NO
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO4350B 60mil, Tg 288℃
|
|
Final
foil external:
|
1.5oz
|
|
Final
foil internal:
|
0oz
|
|
Final
height of PCB:
|
1.6mm
±0.16
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Electroless
nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel)
|
|
Solder
Mask Apply To:
|
NO
|
|
Solder
Mask Color:
|
NO
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
NO
|
|
Colour
of Component Legend
|
NO
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
Through Hole(PTH)
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
(0.15mm)
|
|
Board
plating:
|
0.0030"
(0.076mm)
|
|
Drill
tolerance:
|
0.002"
(0.05mm)
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Typical applications are as follows:
Data sheet of Rogers 4350B (RO4350B )：
|
Property
|
RO4350B
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.48±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.66
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0037
0.0031
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+50
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.2 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
5.7 x109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
16,767(2,432)
14,153(2,053)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
203(29.5)
130(18.9)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
255
(37)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.5
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
10
12
32
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃ TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
390
|
|
℃ TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.69
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.86
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
0.88
(5.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
(3)V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
BICEHNG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:
