Rogers RO3003 High Frequency PCB 2-Layer Rogers
3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB
The
mechanical properties are consistent. This allows the designer to develop
multi-layer board designs without encountering warpages or reliability
problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in
the X and Y axis of 17 ppm/℃.
This expansion coefficient is matched to that of copper, which allows the
material to exhibit excellent dimensional stability, with typical etch
shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE
is 24 ppm/℃, which
provides exceptional plated through-hole reliability, even in severe
environments.
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
PCB Specifications:
|
PCB SIZE
|
100 x
100mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
NO
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 35 um(1 oz)
|
|
RO3003 0.254mm
|
|
copper ------- 35 um(1 oz)
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5mil
/ 5mil
|
|
Minimum
/ Maximum Holes:
|
0.3mm
/ 0.8mm
|
|
Number
of Different Holes:
|
N/A
|
|
Number
of Drill Holes:
|
N/A
|
|
Number
of Milled Slots:
|
N/A
|
|
Number
of Internal Cutouts:
|
N/A
|
|
Impedance
Control:
|
N/A
|
|
Number
of Gold finger:
|
N/A
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO3003
0.254mm
|
|
Final
foil external:
|
1oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.3
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
N/A
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
N/A
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
N/A
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 3003 (RO3003):
|
RO3003 Typical Value
|
|
Property
|
RO3003
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.0±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
3
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.001
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-3
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.06
0.07
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
107
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
107
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
930
823
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.04
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
0.9
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.5
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
16
25
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper Peel
Stength
|
12.7
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
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