Rogers
RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With
Immersion Gold and Immersion Tin
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description:
RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based
material which are cost/performance materials from Rogers Corporation,
specifically engineered and manufactured to meet the specific demands of the
antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of
0.0027 measured at 10 GHz. These values allow antenna designers to realize
substantial gain values while minimizing signal loss. Thus, it provides
excellent passive intermodulation response required for mobile infrastructure
microstrip antenna applications.
It
is an affordable alternative to more conventional PTFE antenna technologies,
thus allowing our designers to optimize the price and performance of the
antennas. The resin systems of RO4534 dielectric materials are designed to
provide the necessary properties for ideal antenna performance. The
coefficients of thermal expansion (CTEs) in both the X and Y directions are
similar to that of copper. The good CTE match reduces stresses in the printed
circuit board antenna.
Features
and Benefits:
1.
Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use
2.
Thermoset resin system: Compatible with standard PCB fabrication
3.
Excellent dimensional stability: Greater
yield on larger panels sizes
4.
Uniform mechanical properties: Maintains mechanical form during handling
5.
High thermal conductivity: Improved power handling
Typical
Applications:
1.
Cellular infrastructure base station antennas
2.
WiMAX antenna networks
Our
PCB Capability (RO4534):
|
PCB Capability (RO4534)
|
|
PCB Material:
|
Ceramic-filled,
Glass-reinforced Hydrocarbon
|
|
Designation:
|
RO4534
|
|
Dielectric constant:
|
3.4
|
|
Dissipation Factor
|
0.0027 10GHz
|
|
Layer count:
|
Double Sided PCB, Multilayer PCB, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
20mil
(0.508mm), 30mil (0.762mm), 60mil (1.524mm
)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated
etc..
|
RO4534
Typical Values:
|
Property
|
RO4534
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant, er Process
|
3.4
± 0.08
|
Z
|
-
|
10 GHz/23℃2.5 GHz
|
IPC-TM-650,2.5.5.5
|
|
Dissipation Factor
|
0.0022
|
Z
|
-
|
2.5 GHz/23℃
|
IPC-TM-650,
2.5.5.5
|
|
0.0027
|
10 GHz/23℃
|
|
PIM (Typical)
|
-157
|
-
|
dBc
|
Reflected
43 dBm swept tones
|
Summitek
1900b PIM Analyzer
|
|
Dielectric Strength
|
>500
|
Z
|
V/mil
|
0.51
mm
|
IPC-TM-650,
2.5.6.2
|
|
Dimensional Stability
|
<0.3
|
X,Y
|
mm/m
(mils/inch)
|
after
etch
|
IPC-TM-650,
2.4.39A
|
|
Coefficient of Thermal Expansion
|
11
|
X
|
ppm/℃
|
-55 to 288℃
|
IPC-TM-650,
2.4.41
|
|
14
|
Y
|
|
46
|
Z
|
|
Thermal Conductivity
|
0.6
|
-
|
W/(m.K)
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
-
|
%
|
D48/50
|
IPC-TM-650,
2.6.2.1 ASTM D570
|
|
Tg
|
>280
|
-
|
℃TMA
|
A
|
IPC-TM-650,
2.4.24.3
|
|
Density
|
1.8
|
-
|
gm/cm3
|
-
|
ASTM
D792
|
|
Copper Peel Strength
|
6.3（1.1）
|
-
|
lbs/in
(N/mm)
|
1
oz. EDC post solder float
|
IPC-TM-650,
2.4.8
|
|
Flammability
|
NON
FR
|
-
|
-
|
-
|
UL
94
|
|
Lead-Free Process Compatible
|
Yes
|
-
|
-
|
-
|
-
|
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