Rogers
TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With
Immersion Gold
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description：
Rogers'
TMM6 thermoset microwave laminates are ceramic, hydrocarbon, thermoset polymer
composites designed for high PTH reliability stripline and microstrip
applications. It has the dielectric constant of 6.0 and dissipation factor of
0.0023.
Its
isotropic coefficients of thermal expansion is very closely matched to copper
which results in production of high reliability plated through holes, and low
etch shrinkage values. Furthermore, the thermal conductivity of TMM6 is
approximately twice that of traditional PTFE/ceramic laminates, facilitating
heat removal.
Since
TMM6 is based on thermoset resins, and do not soften when heated. So wire
bonding of component leads to circuit traces can be performed without concerns
of pad lifting or substrate deformation.
Typical
Applications
1.
Chip testers
2.
Dielectric polarizers and lenses
3.
Filters and coupler
4.
Global Positioning Systems Antennas
5.
Patch Antennas
6.
Power amplifiers and combiners
7.
RF and microwave circuitry
8.
Satellite communication systems
Our
PCB Capability(TMM6)
|
PCB
Material:
|
Ceramic,
Hydrocarbon, Thermoset Polymer Composites
|
|
Designation:
|
TMM6
|
|
Dielectric constant:
|
6
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
15mil (0.381mm), 20mil (0.508mm), 25mil
(0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm),
100mil (2.54mm), 125mil (3.175mm),
150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm),
300mil (7.62mm), 500mil (12.7mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated
etc..
|
Why
Choose Us?
1.ISO9001,
ISO14001, IATF16949, ISO13485, UL Certified;
2.More
than 18+ years’ high frequency PCB experience;
3.Small
quantity order is available, no MOQ required;
4.We’re
a Team of passion, discipline, responsibility and honesty;
5.Delivery
on time: >98%, Customer complaint rate: <1%
6.16000㎡workshop, 30000㎡output a month and 8000
types of PCB's a month;
7.Powerful
PCB capabilities support your research and development, sales and marketing;
8.IPC
Class 2 / IPC Class 3
Typical
Value of TMM6
|
Property
|
TMM6
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.0±0.08
|
Z
|
|
10 GHz
|
IPC-TM-650
2.5.5.5
|
|
Dielectric Constant,εDesign
|
6.3
|
-
|
-
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor (process)
|
0.0023
|
Z
|
-
|
10
GHz
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of dielectric constant
|
-11
|
-
|
ppm/°K
|
-55℃-125℃
|
IPC-TM-650
2.5.5.5
|
|
Insulation Resistance
|
>2000
|
-
|
Gohm
|
C/96/60/95
|
ASTM
D257
|
|
Volume Resistivity
|
2 x 10^8
|
-
|
Mohm.cm
|
-
|
ASTM
D257
|
|
Surface Resistivity
|
1 x 10^9
|
-
|
Mohm
|
-
|
ASTM
D257
|
|
Electrical
Strength(dielectric strength)
|
362
|
Z
|
V/mil
|
-
|
IPC-TM-650
method 2.5.6.2
|
|
Thermal Properties
|
|
Decompositioin Temperature(Td)
|
425
|
425
|
℃TGA
|
-
|
ASTM D3850
|
|
Coefficient of Thermal Expansion - x
|
18
|
X
|
ppm/K
|
0 to 140℃
|
ASTM E 831
IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Y
|
18
|
Y
|
ppm/K
|
0
to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Z
|
26
|
Z
|
ppm/K
|
0
to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Thermal Conductivity
|
0.72
|
Z
|
W/m/K
|
80℃
|
ASTM
C518
|
|
Mechanical Properties
|
|
Copper Peel Strength after Thermal Stress
|
5.7 (1.0)
|
X,Y
|
lb/inch (N/mm)
|
after solder float 1 oz. EDC
|
IPC-TM-650
Method 2.4.8
|
|
Flexural Strength (MD/CMD)
|
15.02
|
X,Y
|
kpsi
|
A
|
ASTM
D790
|
|
Flexural Modulus (MD/CMD)
|
1.75
|
X,Y
|
Mpsi
|
A
|
ASTM
D790
|
|
Physical Properties
|
|
Moisture Absorption (2X2)
|
1.27mm
(0.050")
|
0.06
|
-
|
%
|
D/24/23
|
ASTM D570
|
|
3.18mm (0.125")
|
0.2
|
|
Specific Gravity
|
2.37
|
-
|
-
|
A
|
ASTM
D792
|
|
Specific Heat Capacity
|
0.78
|
-
|
J/g/K
|
A
|
Calculated
|
|
Lead-Free Process Compatible
|
YES
|
-
|
-
|
-
|
-
|
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
