Typical 1.6×1.2×0.35mm ultra thin SMD crystal
1. RoHS compliant Lead free soldering
2. Frequency Range: 24MHz-54MHz
3. Tight tolerance +/-10ppm available
4. Main application in Bluetooth Module, smart phone, wireless LAN, Home and office automation, and audio & video
5.Ceramic seam weld package with excellent reliability performance, available to surface mount technology and IR reflow process
Electrical Parameters
|
Item
|
Electrical
Specification
|
|
Min.
|
Type
|
Max.
|
Units
|
|
Nominal Frequency
|
32
|
MHz
|
|
Mode of Vibration
|
AT
Fund
|
|
Frequency Tolerance
|
20
|
-
|
20
|
ppm
|
|
Operating Temperature Range
|
-40
|
-
|
85
|
℃
|
|
Frequency Tolerance
|
-30
|
-
|
30
|
ppm
|
|
Storage Temperature
|
-55
|
-
|
125
|
℃
|
|
Load capacitance
|
-
|
8
|
-
|
pF
|
|
Equivalent Series Resistance
|
-
|
-
|
200
|
Ω
|
|
Drive Level
|
-
|
50
|
100
|
μW
|
|
Insulation Resistance
|
500
|
-
|
-
|
MΩ
|
|
Shunt Capacitance
|
-
|
-
|
3
|
pF
|
|
Aging Per Year
|
-2
|
-
|
2
|
ppm
|
|
Package type
|
P1SB
|
Dimensions
Reflow
|
Profiles Feature
|
Pb-Free Assembly
|
|
Average Ramp-up Rate (Ts max to Tp)
|
3℃/Second max.
|
Preheat
■ Temperature Min (Ts min)
■ Temperature Max (Ts max)
■ Time (ts min to ts max)
|
125℃
200℃
60~180 seconds
|
Time maintained above
■ Temperature (TL)
■ Time (tL)
|
217℃
60~150 seconds
|
|
Peak/Classification Temperature (Tp)
|
260℃
|
Time within 5℃ of actual Peak
Temperature (tp)
|
20~40 seconds
|
|
Ramp-down rate
|
6℃/second max.
|
|
Time 25℃ to Peak Temperature
|
8 minutes max.
|
|
Suggest reflow times
|
3 Times max
|
