Thin PCB 0.2mm FR-4 Printed Circuit
Board with White Solder Mask and OSP
(Printed circuits boards are custom-made
products, the picture and parameters shown are just for reference)
General Description:
This is a type of thin PCB as thin as 0.2mm, it’s
made on conventional FR-4 substrate with single layer copper, 1oz copper
finished.
Specifications:
PCB SIZE
|
256 x 66mm=1PCS
|
Base Material:
|
FR-4
|
Number of Layers
|
Single sided PCB
|
SMT
|
YES
|
Through Hole Components
|
no
|
LAYER STACKUP
|
Copper
------- 35um(1oz)
|
FR-4
|
Minimum Trace and Space:
|
59mil/59mil
|
Minimum / Maximum Holes:
|
0.5mm/
5.8mm
|
Final foil external:
|
1oz
|
Final foil internal:
|
0oz
|
Final height of PCB:
|
0.22mm
|
Surface Finish
|
OSP
|
Solder Mask Apply To:
|
TOP
|
Solder Mask Color:
|
White solder
mask
|
CONTOUR/CUTTING
|
Punching
|
Side of Component Legend
|
TOP
|
Colour of Component Legend
|
Blue silkscreen
|
VIA
|
None
Plated Through Hole(NPTH)
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
TEST
|
100%
Electrical Test prior shipment
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
SERVICE AREA
|
Worldwide,
Globally.
|
Typical
Applications:
Security
Electronics
Program
Logic Control
Industrial
Systems
Car
Tracking Systems
Electronic
Counter
External
WiFi Antenna
Our
Advantages:
Engineering
design prevents problems from occurring in pre-production;
PCB
manufacturing is strictly as per required specifications;
Strict
WIP inspection and monitoring as well as working instruction;
Powerful
PCB capabilities support your research and development, sales and marketing;
Delivery
on time higher than 98% on-time-delivery rate;
30000㎡output capability per month;
Delivery
on time higher than 98% on-time-delivery rate;
Our Capabilities 2022:
Parameter
|
Value
|
Layer Counts
|
1-32
|
Substrate Material
|
RO4350B, RO4003C, RO4730G3, RO4360G2,
RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880;
RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4,
TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10,
TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2
DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15,
DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High
Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
Polyimide, PET; Metal Core etc.
|
Maximum Size
|
Flying test: 900*600mm, Fixture
test 460*380mm, No test 1100*600mm
|
Board Outline Tolerance
|
±0.0059"
(0.15mm)
|
PCB Thickness
|
0.0157"
- 0.3937" (0.40mm--10.00mm)
|
Thickness Tolerance(T≥0.8mm)
|
±8%
|
Thickness Tolerance(t<0.8mm)
|
±10%
|
Insulation Layer Thickness
|
0.00295"
- 0.1969" (0.075mm--5.00mm)
|
Minimum Track
|
0.003"
(0.075mm)
|
Minimum Space
|
0.003" (0.075mm)
|
Outer Copper Thickness
|
35µm--420µm (1oz-12oz)
|
Inner Copper Thickness
|
17µm--350µm (0.5oz - 10oz)
|
Drill Hole(Mechanical)
|
0.0059"
- 0.25" (0.15mm--6.35mm)
|
Finished Hole(Mechanical)
|
0.0039"-0.248"
(0.10mm--6.30mm)
|
DiameterTolerance(Mechanical)
|
0.00295"
(0.075mm)
|
Registration (Mechanical)
|
0.00197"
(0.05mm)
|
Aspect Ratio
|
12:1
|
Solder Mask Type
|
LPI
|
Min Soldermask Bridge
|
0.00315"
(0.08mm)
|
Min Soldermask Clearance
|
0.00197"
(0.05mm)
|
Plug via Diameter
|
0.0098"
- 0.0236" (0.25mm--0.60mm)
|
Impedance Control Tolerance
|
±10%
|
Surface Finish
|
HASL,HASL
LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
|
FR-4
Material Description:
Today,
FR-4 is still the workhorse of the PCB fabrication industry, a material based
on an epoxy resin system. It begins to soften at a temperature of 130°C (glass transition
temperature, Tg) and exhibits a high expansion in the Z-axis direction when
heated above the Tg temperature.
FR-4
(or FR4) is a kind of material grade designation, which means that the resin
material is flame resistant (self-extinguishing). FR-4 is a kind of material
specifications, not a material name, but a material grade. "FR"
stands for flame retardant, and denotes that safety of flammability of FR-4 is
in compliance with the standard UL94V-0.
FR-4
glass epoxy is a popular and versatile high-pressure thermoset plastic laminate
with good strength to weight ratios. With near zero water absorption, FR-4 is
most commonly used as an electrical insulator possessing considerable
mechanical strength. The material is also known to retain its high mechanical
values and electrical insulating qualities in both dry and humid conditions.
These attributes, along with good fabrication characteristics, lend utility to
this grade for a wide variety of electrical and mechanical applications.
Laminates
--- FR-4 Applied on printed circuit boards (PCBs)
FR-4
grade materials are generally used on the circuit board has many types, but
most are based on the so-called four function (Tera-Function) composite
material which is composed of woven fiberglass cloth with an epoxy resin binder
that is flame resistant.
FR-4
is the primary insulating backbone upon which the vast majority of rigid
printed circuit boards (PCBs) are produced. A thin layer of copper foil is
laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly
referred to as copper clad laminates (CCL).
FR-4
copper-clad sheets are fabricated with circuitry interconnections etched into
copper layers to produce printed circuit boards (PCBs). More sophisticated and
complex FR-4 printed circuit boards (PCBs) are produced in multiple layers,
also known as "multilayer circuitry".
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