Off-line and on-line PCB laser cutting machine
On-line PCB laser cutting machine advantages:
Suitable for arbitrary shape cutting, no dust in the processing process, fine cutting seam and small heat affected zone.
Scope of application: it is suitable for micro machining of various materials, including PCB, FPC and soft and hard combination board (including assembled circuit board) with a thickness of less than 0.8mm
Summary of PCB Depaneling Process:
With the rapid development of electronic technology, more and more electronic products are assembling more and more dense, smaller and more components onto smaller, thinner and more irregular circuit boards, which brings greater challenges to the PCB depaneling process. Therefore, we provide a more environmentally friendly, fast, precise and reliable laser precision cutting scheme to meet the needs of this trend.
PCB Laser Depaneling Machine Features
1. No stress: special vehicles cooperate with laser processing, even if the components are very close to the cutting path, there is no stress effect.
2. Accurate thermal impact control: select the appropriate laser type according to different thermal impact requirements and cooperate with the appropriate laser processing parameters to minimize the thermal impact.
3. Cleaning processing: laser soot treatment is carried out in real time during the processing process to minimize the impact of soot on circuit components.
4. Multi function: it is not only suitable for precision cutting and drilling of soft plate, hard plate and soft hard combination plate of various thickness, but also suitable for cutting and drilling of other materials, such as glass, ceramics, thin metal plate and so on.
5. Safety: the processing area is completely closed to ensure the safety protection of the processing process; Designed in accordance with Chinese and EU electrical standards.
6. Automation: open ports are reserved to facilitate the adaptation of power control system, automatic loading and unloading system and MES system to meet various automation needs.
7. High speed and high precision: high speed and high precision X / Y / Z mobile system, perfect precision compensation mechanism, including single axis precision compensation, plane precision compensation and scanning area precision compensation. The motion control system is equipped with contract axis CCD positioning system to ensure high speed and high precision in the processing process.
8. High degree of freedom: a variety of nanosecond, picosecond ultraviolet and green lasers are available to meet different processing needs.
9. Simple and fast operation: the software interface is simple, compatible with the conventional data format of the industry, simple operation and user-friendly.
10. Power detection system: power online detection system can be optional to ensure stable power and preserve the consistency of cutting quality.
